NINA-W1 series - System integration manual
UBX-17005730 - R11 Handling and soldering Page 46 of 55
C1 - Public
4.3.3 Other remarks
• Only a single reflow soldering process is allowed for boards with a module populated on it.
• Boards with combined through-hole technology (THT) components and surface-mount technology
(SMT) devices may require wave soldering to solder the THT components. Only a single wave
soldering process is allowed for boards populated with the modules.
Miniature Wave Selective
Solder
process is preferred over traditional wave soldering process.
• Hand soldering is not recommended.
• Rework is not recommended.
• Conformal coating may affect the performance of the module, it is important to prevent the liquid
from flowing into the module. The RF shields do not provide protection for the module from coating
liquids with low viscosity, therefore care is required in applying the coating. Conformal coating of
the module will void the warranty.
• Grounding metal covers: attempts to improve grounding by soldering ground cables, wick or other
forms of metal strips directly onto the EMI covers is done at the customer's own risk and will void
the warranty of the module. The numerous ground pins are adequate to provide optimal immunity
to interferences.
• The module contains components that are sensitive to Ultrasonic Waves. Use of any ultrasonic
processes such as cleaning, welding etc., may damage the module. Use of ultrasonic processes on
an end product integrating this module will also void the warranty.
To Next Page
Loading...
