Ublox NINA-W106 - Page 4

NINA-W1 series - System integration manual
UBX-17005730 - R11 Contents Page 4 of 55
C1 - Public
2.8.3 Downloading the toolchain ............................................................................................................. 25
2.9 Output power configuration ................................................................................................................... 29
2.9.1 NINA-W10 series .............................................................................................................................. 29
2.9.2 NINA-W13/W15 series .................................................................................................................... 31
Design-in ............................................................................................................................................. 32
3.1 Overview ...................................................................................................................................................... 32
3.2 Supply interfaces ...................................................................................................................................... 32
3.2.1 Module supply (VCC) design ........................................................................................................... 32
3.2.2 Digital I/O interfaces reference voltage (VCC_IO) ...................................................................... 32
3.3 Antenna interface ..................................................................................................................................... 33
3.3.1 RF transmission line design (NINA-W1x1) .................................................................................. 33
3.3.2 Antenna design (NINA-W1x1) ........................................................................................................ 35
3.3.3 On-board antenna design ............................................................................................................... 38
3.4 Data communication interfaces ............................................................................................................ 40
3.4.1 Asynchronous serial interface (UART) design ............................................................................ 40
3.4.2 Ethernet (RMII+SMI) ........................................................................................................................ 40
3.5 General high-speed layout guidelines .................................................................................................. 40
3.5.1 General considerations for schematic design and PCB floor-planning ................................. 41
3.5.2 Module placement ............................................................................................................................ 41
3.5.3 Layout and manufacturing ............................................................................................................. 41
3.6 Module footprint and paste mask ......................................................................................................... 41
3.7 Thermal guidelines ................................................................................................................................... 42
3.8 ESD guidelines ........................................................................................................................................... 42
Handling and soldering ................................................................................................................... 44
4.1 Packaging, shipping, storage and moisture preconditioning .......................................................... 44
4.2 Handling ...................................................................................................................................................... 44
4.3 Soldering ..................................................................................................................................................... 44
4.3.1 Reflow soldering process ................................................................................................................ 44
4.3.2 Cleaning .............................................................................................................................................. 45
4.3.3 Other remarks ................................................................................................................................... 46
Approvals ............................................................................................................................................ 47
5.1 General requirements .............................................................................................................................. 47
5.2 FCC/IC End-product regulatory compliance ........................................................................................ 47
5.2.1 NINA-W10 series FCC ID and IC certification number .............................................................. 47
5.2.2 NINA-W13/W15 series FCC ID and IC certification number .................................................... 47
5.2.3 Antenna requirements .................................................................................................................... 48
Product testing ................................................................................................................................. 49
6.1 u-blox In-Series production test ............................................................................................................. 49
6.2 OEM manufacturer production test ..................................................................................................... 49
6.2.1 “Go/No go” tests for integrated devices ...................................................................................... 50
Appendix .................................................................................................................................................... 51
A Glossary .............................................................................................................................................. 51
Related documents ................................................................................................................................ 53