In order to prevent falling off during soldering of the module, do not solder it on
the back of the board during design, that is, better not go through soldering
cycle twice.
The setting of soldering temperature depends on many factors of the factory,
such as board type, solder paste type, solder paste thickness, etc. Please also
refer to the relevant IPC standards and indicators of solder paste.
Since the lead soldering temperature is relatively low, if using this method,
please give priority to other components on the board.
The opening of the stencil needs to meet your design requirement and comply
to the examine standards. The thickness of the stencil is recommended to be
0.15 mm.
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