UM960 User Manual
UC-00-M34 EN R1.0 Packaging 15
5 Packaging
5.1 Label Description
Figure 5-1 Label Description
5.2 Product Packaging
The UM960 module uses carrier tape and reel (suitable for mainstream surface mount
devices), packaged in vacuum-sealed aluminum foil antistatic bags, with a desiccant
inside to prevent moisture. When using reflow soldering process to solder modules,
please strictly comply with IPC standard to conduct humidity control. As packaging
materials such as the carrier tape can only withstand the temperature of 55 °C, modules
shall be removed from the package during baking.
Figure 5-2 UM960 Package
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