UC-00-M32 EN R1.0 Packaging 17
In order to prevent falling off during soldering of modules, do not solder the
module on the back of the board during design, and it is not recommended to
go through soldering cycle twice.
The setting of soldering temperature depends on many factors of the factory,
such as board type, solder paste type, solder paste thickness etc. Please also
refer to the relevant IPC standards and indicators of solder paste.
Since the lead soldering temperature is relatively low, if using this method,
please give priority to other components on the board.
The opening of the stencil needs to meet your design requirement and comply
to the examine standards. The thickness of the stencil is recommended to be
larger than 0.18 mm.
5 Packaging
5.1 Label Description
Figure 5-1 Label Description
5.2 Product Packaging
The UM980 module uses carrier tape and reel (suitable for mainstream surface mount
devices), packaged in vacuum-sealed aluminum foil antistatic bags, with a desiccant
inside to prevent moisture. When using reflow soldering process to solder modules,
please strictly comply with IPC standard to conduct humidity control on the modules. As
packaging materials such as the carrier tape can only withstand the temperature of 55
degrees Celsius, modules shall be removed from the package during baking.
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