3
Chapter 2: Overview
Congratulations on your purchase of the Veeco Mark™II fluid cooled
ion source with hollow cathode electron source. The gridless end-Hall
design offers operational flexibility and reduced sensitivity to contamina-
tion from the surrounding environment. This ion source’s high-current
density, total beam current and low energy beam characteristics facilitate
a variety of property enhancement and reactive processes. It is particularly
well suited to industrial vacuum applications involving:
• Precleaning – Low energy ion beam precleaning removes
surface contaminants (water vapor, hydrocarbons, native
oxides and absorbed materials), to improve film/substrate
adhesion.
• Ion assisted deposition – Ion bombardment of the substrate
assists film growth, adhesion and hardness while reducing
absorbed residual gas contaminants and film stress.
The ion’s accelerating potential difference is generated with a magnetic
field and a substantial electron current. The source generates a maximum
beam current of approximately 2 to 3A (for argon and oxygen) with a
mean ion beam current energy that can range from 40 to 200eV, depend-
ing upon the source's input settings. Typical operating gases include
argon, krypton, xenon, nitrogen and oxygen. For reference, basic operat-
ing characteristics have been included for argon and oxygen. Refer to the
“Specifications” chapter for details.
The source consists of the following basic elements:
• stainless steel anode and exterior shell
•magnet
• input gas distributor
• gas and electrical feedthroughs and connections
• hollow cathode electron source (HCES)
• fluid cooling and fittings
• gold plated fasteners.
The source and feedthroughs have been engineered for straightforward
installation and ease of use. If you do need help, Veeco’s “Service Sup-
port” team is available to assist you.
To Next Page
Loading...
Need help?
General