Substance
Proposed Maximum
Concentration
Actual
Concentration
Lead (Pb) 0.1% < 0.1%
Mercury (Hg) 0.1% < 0.1%
Cadmium (Cd) 0.01% < 0.01%
Hexavalent Chromium
(Cr6⁺)
0.1% < 0.1%
Polybrominated
biphenyls (PBB)
0.1% < 0.1%
Polybrominated
diphenyl ethers
(PBDE)
0.1% < 0.1%
Bis (2-ethylhexyl)
phthalate (DEHP)
0.1% < 0.1%
Butyl benzyl phthalate
(BBP)
0.1% < 0.1%
Dibutyl phthalate
(DBP)
0.1% < 0.1%
Diisobutyl phthalate
(DIBP)
0.1% < 0.1%
Certain components of products as stated above are exempted under the Annex III of
the RoHS2 Directives as noted below. Examples of exempted components are:
Lead as an alloying element in aluminum containing up to 0.4% lead by weight.
Copper alloy containing up to 4% lead by weight.
Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or
more lead).
Electrical and electronic components containing lead in a glass or ceramic other than dielectric
ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound.
Restriction on Hazardous Substances statement (India). This product complies with the “India E-
waste Rule 2011” and prohibits use of lead, mercury, hexavalent chromium, polybrominated biphenyls
or polybrominated diphenyl ethers in concentrations exceeding 0.1 weight % and 0.01 weight % for
cadmium, except for the exemptions set in Schedule 2 of the Rule.
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