CLP–110–02–F–D–P
CLP–130–02–L–D
CLP–116–02–L–D
CLP–116–02–F–DH
High reliability
Tiger-Claw contacts
Low Profile
(2,21mm) .087"
(1,27mm x 1,27mm)
.050" x .050"
micro pitch
Surface
Mount
Suitable for
pass-through
applications
SAMTEC USA • Tel: 1-800-SAMTEC-9 or 812-944-6733 • Fax: 812-948-5047 SAMTEC UK • Tel: 01236 739292 • Fax: 01236 727113 SAMTEC ASIA PACIFIC • Tel: 65-745-5955 • Fax: 65-841-1502
SAMTEC GERMANY • Tel: +49 (0) 89 / 89460-0 • Fax: +49 (0) 89 / 89460-299 SAMTEC FRANCE • Tel: 01 60 95 06 60 • Fax: 01 60 95 06 61 SAMTEC ITALY • Tel: 39 039 6890337 • Fax: 39 039 6890315
SAMTEC JAPAN • Tel: 81-424-42-8318 • Fax: 81-424-42-8319 SAMTEC CHINA • Tel: 86-21-5385-4089 • Fax: 86-21-5385-4047 SAMTEC TAIWAN • Tel: (02) 2395-1677 • Fax: (02) 2395-1689
Due to technical progress, all designs, specifications and components are subject to change without notice.
FACTSHEET F-200
Processing:
Max Processing Temp:
230°C for 60 seconds
SMT Lead Coplanarity:
(0,10mm) .004" max (02-35)
(0,15mm) .006" max (36-50)
Suggested Paste
Thickness:
For most applications add
(0,05mm) .002" to max SMT
lead coplanarity
Suggested PCB Layouts:
Your specific layout may vary
Note: Some sizes, styles and
options are non-standard,
non-returnable.
LOW PROFILE SOCKETS
1
OTHER
OPTION
PLATING
OPTION
02 thru 50
NO. PINS
PER ROW
CLP
02
–BE
= Bottom Entry
(Required
for bottom entry
applications)
–K
(Best Cost Option)
= (4,00mm) .157"
DIA Polyamide film
Pick & Place Pad
(5 positions min.)
–P
= Pick & Place Pad
(5 positions min.
–D only)
(Not always
necessary for
auto placement.
See Flex
Processing.)
–PA
= Pick &
Place Pad with
Alignment Pin
(–D only)
–TR
= Tape & Reel
Mates with:
FTSH, FTS, FW, DIS5
CLP
SERIES
OPTIONS
–TR OPTION
ROW
OPTION
–D
= Double
Row
–DH
= Double
Horizontal
–P OPTION
–DH OPTION
–PA OPTION
Alignment pins available.
Call Samtec.
APPLICATION
SPECIFIC OPTION
–G
(Best Cost
Option)
= 10
µ" (0,25µm)
Gold
(–D only)
–F
= Pre-plated
Gold flash
on contact,
75
µ" (1,91µm)
Tin on tail
–L
= Pre-plated
(0,25
µm) 10µ"
Gold on contact,
75
µ" (1,91µm)
Tin on tail
No. of Positions
x (1,27).050
(1,27)
.050
(1,27)
.050
(0,46)
.018
(3,05)
.120
(3,05)
.120
(4,57)
.180
(4,32)
.170
(2,44)
.096
(6,35)
.250
x
(3.18)
.125
99
100
01
02
(2,26)
.089
(3,43)
.135
(0,89)
.035 DIA
(7,00)
.275
(3,00)
.118
(1,40)
.055
(8,25)
.325
A
A
(3,56) .140
(7,11) .280
PIN/ROW
04-15
16-50
Board fixturing may be required
to assure proper alignment for
pass-through applications.
–DH
–D
(5,21)
.205
(0,74)
.029
DIA
(Pass-Thru)
(0,74)
.029
(6,98)
.275
(1,27)
.050
TYP
(1,47)
.058
(1,27)
.050
-PA
Option
(0,93)
.037
DIA(2)
(5,33)
.210
(0,71)
.028
(1,35)
.053
TAPE & REEL AVAILABILITY
Call Samtec for specifications
and ordering information.
No tooling charges.
125 piece minimum order.
Order any quantity above minimum.
In-house design, manufacture.
Quick turn-around.
SPECIFICATIONS
Materials:
Insulator Material:
Black Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Current Rating:
1.75A @ 80°C ambient
Operating Temp Range:
-65°C to +125°C
Plating: Sn or Au over
50µ" (1,27µm) Ni
Contact Resistance:
10 mΩ max
Insertion Depth:
Top Entry = (1,40mm) .055"
minimum, Bottom Entry =
(2,21mm) .087" minimum
plus board thickness
DH Entry = (2,31mm) .091"
to (2,67mm) .105"
Insertion Force:
3.8oz (1,05N) average
Normal Force:
60 grams (0,59N) average
Withdrawal Force:
2oz (0,56N) average
Max Cycles:
100 with 10µ" (0,25µm) Au
–DH
–PA OPTION
–D
–P OPTION
Alignment pins are located
about centerline of the part. If
odd pins/row then on middle
position. If even then between
middle two positions.
Surface
SMT
Mount
C
O
S
T
S
A
V
I
N
G
S
O
L
U
T
I
O
N
S
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