SERVICE MANUAL
HAMAMATSU, JAPAN
CL
001772
CONTENTS
SPECIFICATIONS .................................................................... 3
PANEL LAYOUT ........................................................................ 4
DISASSEMBLY PROCEDURE ................................................. 5
LSI PIN DESCRIPTION .......................................................... 17
IC BLOCK DIAGRAM.............................................................. 20
CIRCUIT BOARDS ................................................................. 21
INSPECTIONS ........................................................................ 38
DATA BACKUP........................................................................ 43
MIDI IMPLEMENTATION CHART ........................................... 47
MIDI DATA FORMAT ............................................................... 48
PARTS LIST
BLOCK DIAGRAM
CIRCUIT BOARD LAYOUT & WIRING
OVERALL CIRCUIT DIAGRAM
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