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Agilent Technologies E444xAU Option H37 Service Guide

Agilent Technologies E444xAU Option H37
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382 Chapter 11
Assembly Replacement Procedures
A25 Motherboard
A25 Motherboard
Removing the motherboard requires the removal of all the other
assemblies in the instrument. Take care to note the locations of cables
and screws for correct placement during reassembly.
CAUTION Use ESD precautions when performing this replacement procedure.
NOTE The motherboard assembly consists of the A25 motherboard and the
MP35 motherboard shield. A replacement motherboard does not
include the shield, so when you change a faulty motherboard you must
transfer the shield to the new motherboard.
Removal
1. Remove the instrument top brace. Refer to the “Top Brace” removal
procedure.
2. Remove the front frame. Refer to the “Front Frame” removal
procedure.
3. Remove the vertical assemblies. Refer to the “Vertical Board
Assemblies (Standard Instrument)” removal procedure.
4. Remove the A5 assembly. Refer to the “A5 Power Supply” removal
procedure.
5. Remove the A26 assembly. Refer to the “A26 CPU Assembly”
removal procedure.
6. Remove the RF section. Refer to the “RF Section E4440A, E4443A,
E4445A” removal procedure.
7. Remove the mid-web/fan assembly. Refer to the “Fans/Mid Web”
removal procedure.
8. Remove the attenuator assembly. Refer to the “Attenuator Assembly
E4440A, E4443A, E4445A” removal procedure.
9. Remove the W8 front panel ribbon cable from the motherboard.
Detach the disk drive cover (refer to Figure 11-45 on page 379) and
remove the W10 disk drive flat flex cable from the motherboard.
10.Using the T-10 driver, remove the 6 screws (2) from the bottom of
the instrument as indicated in Figure 11-47.
11.Refer to Figure 11-45 on page 379. Remove the 7 screws (2) securing
the A21 motherboard to the deck. Lift the motherboard out of the
deck.

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Agilent Technologies E444xAU Option H37 Specifications

General IconGeneral
BrandAgilent Technologies
ModelE444xAU Option H37
CategoryMeasuring Instruments
LanguageEnglish

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