3
1-2 Specification
Spec Description
Design
∗ Nano ITX form factor 6 layers PCB size: 12.0x12.0cm
Chipset
∗ Northbridge: AMD Geode LX800
∗ Southbridge: AMD CS5536 Chipset
Embedded CPU
∗ Support 133MHz Front Side Bus AMD Geode™ LX800
processor up to 533 MHz
∗ Low Power Consumption and Fanless
∗ Socket-A AMD Geode™ LX Series processor utilizing BGA481
package.
∗ 64K L1 and 128K L2 Cache
Memory Socket
∗ 200-pin DDR SODIMM socket x1
∗ Support DDR 400/333 system RAM Modules DDR memory
∗ Expandable to 1GB.
Integrated VGA
∗ Integrated FPU that support MMX and AMD 3DNow!
Technology instructions sets
∗ 9 GB/s internal Geode Link technology Interface Unit(GLIU)
∗ High-resolution CRT outputs
∗ VESA 1.1 and 2.0 VIP/VDA support
Expansion Slots
∗ 32-bit Mini-PCI slot x 1pcs
Integrate IDE
∗ One PCI IDE controller that supports PCI Bus Mastering, ATA
PIO/DMA and the ULTRA DMA 33/66/100 functions that
deliver the data transfer rate up to 100 MB/s;
LAN
∗ Integrated Realtek RTL8110SC PCI 10 / 100 / 1000 LAN.
∗ Support Fast Ethernet LAN function of providing 10Mb/100Mb
data transfer rate