AOC E2260SWD - Page 57

57
065G040222415K---3
NO-SUGGEST MLCC 0402 0.22uF
-10% 16V X5R TDK
2nd source
065G040222415K---A
MLCC 0402 0.22uF -10% 16V X5R
SAMSUNG
2nd source
C102,C103,C105,C107,C
108,C111
065G040247312K---F
MLCC 0402 47nF +-10% 16V X7R
FENGHUA
065G040247312K---3
NO-SUGGEST 0402 47nF -10% 16V
X7R TDK
2nd source
065G040247312K---A
MLCC 0402 47nF -10% 16V X7R
SAMSUNG
2nd source
C412,C413 065G040256031J---Y
MLCC 0402 56pF +-5% 50V NPO
YAGEO
065G040256031J---3 MLCC 0402 56pF -5% 50V NPO TDK 2nd source
065G040256031J---A
MLCC 0402 56pF -5% 50V NPO
SAMSUNG
2nd source
C406 065G0603475A5K---T
MLCC 0603 4.7uF +-10% 10V X5R
TAIYO YUDEN
065G0603475A5K---3
NO-SUGGEST MLCC 0603 4.7uF
-10% 10V X5R TDK
2nd source
065G0603475A5K---M
MLCC 0603 4.7uF -10% 10V X5R
MURATA
2nd source
C401,C404,C409 065G0805106A5K---T
MLCC 0805 10uF +-10% 10V X5R
TAIYO YUDEN
065G0805106A5K---3
NO-SUGGEST MLCC 0805 10uF
-10% 10V X5R TDK
2nd source
065G0805106A5K---M
MLCC 0805 10uF -10% 10V X5R
MURATA
2nd source
U402 070GHDCP500HDC HDCP CODE
FB401,FB402,FB406 071G-56K121--M CHIP BEAD
071G-56K121 CHIP BEAD 2nd source
071G-56K121-TA
CHIP BEAD 120R/6000mA
HCB2012KF-121T60
2nd source
FB101,FB102,FB190 071G-59G301--M CHIP BEAD 0603 300R 25% 200mA
071G-59G301-TA
CHIP BEAD 300OHM 200mA
FCM1608KF-301T02
2nd source
R103,R110,R118 071G-59K190--M CHIP BEAD 0603 19R/500mA
071G-59K190-TA
CHIP BEAD 0603 19R 25% 500mA
FCB1608KF-190T05 TAI-TECH
2nd source
D101,D103 093G--64-42-PP DIODE BAV70 0.125A/85V SOT-23 NXP
093G--64-42--P
DIODE BAV70 0.5A/100V SOT23
PANJIT
2nd source