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4.5 Assembly LP Module to HSG DMD
i. Assembly two Overfill adjustment screws (8F.1A752.8R0) to HSG DMD (Fig. 4-4).
** Adjustment criteria refer to below item 4.6.
ii. Assembly “Clip LP” and lock with screw well (Fig. 4-5).
iii. Press CLIP of BKT_LP first, and then push it into the hole (Fig. 4-6).
iv. Placed LP Module on LP datum of “DMD HSG” and adjustment screw well, shown
(Fig.4-7).
v. Assembly “Baffle LP” first (Fig. 4-8-1) & push “Baffle LP” to hook DMD HSG, and then
lock with screw well (Fig. 4-8-2).
4.6 Overfill Adjustment @ LP Module
Overfill Adjustment Criteria:
i. Pre-assembly 2 adjusting screws. Criteria shown as Fig.4-9.
ii. Alignment Sequence:
a. To adjust “Horizontal Adjustment Screw” firstly, and then “Vertical Adjustment Screw”.
b. Refer to Fig. 4-9.
For Overfill Re-adjustment:
a. Those 2 Adjustment Screws must be released closely to the “Pre-assembly” positions first
(defined in 4.6).
b. Follow adjustment steps shown in Item 4.6-ii.
Fig. 4-4 Fig. 4-5
Overfill Vertical
Adjustment Screw
8F.1A752.8R0
Overfill Horizontal
Adjustment Screw
8F.1A752.8R0
Clip LP
8F.1A752.3R0
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