58
Fig. 3-2
4. Assembly LP module:
4.1 LP must datum well with “BKT_LP” show as Fig. 4-1.
4.2 Referring to Fig. 4-2, it must be visible clearance between “BKT_LP” and ”LP Opening” after
assembling.
Fig. 4-1 Fig. 4-2
4.3 Glue “LP” and “BKT_LP” with ”UV5503 Glue” at two opening of “BKT_LP” show in Fig. 4-3.
4.4 UV-5503 Glue curing process and concerns:
i. The UV-glue must fill up the whole opening area (shown in Fig. 4-3) to contact well with
LP surfaces and “BKT_LP”.
ii. Exposed to visible light at 350 ~ 420nm(at least 100mW/cm2) wavelength for 1 minute.
iii. After curing, the height of UV-glue should not exceed BKT_LP for more than 0.6mm.
Fig. 4-3
Bottom
Datum
Right Datum
Clearance
Glue 5503
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