BenQ MP512 - Page 66

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10. Assembly OP ENG
10.1 Assemble “Baffle DMD” to “HSG DMD” (Fig.10-1).
10.2 Assemble Chip B/D Module to “HSG DMD” (Fig. 10-2).
Fig.10-1
Fig.10-2
10.3 Assemble Thermal Pad & Gasket Hest-sink then place contact DMD (Fig. 10-3).
1. Pre-fastening Sequence: [ 1 ] - [ 2 ] - [ 3 ] - [ 4 ].
2. Fastening Sequence: [ 4 ] - [ 3 ] - [ 2 ] - [ 1 ].
3. Screw Torque must be confirmed to be 6 kg-cm.
Fig. 10-3
Fixed shafts of
DMD HSG
Fixed holes of
ILL SUB HSG
Fixed holes of DMD
Fixed shafts of
DMD HSG
6E.0GF01.001
○1
○3
4G.J2G04.002 Gasket
2
4