12. REMOVAL
The following procedures are designed to minimize or eliminate the contamination normally
associated with the most highly r
eactive gases. Celerity has also designated these
procedures to reduce the overall exposure of wafers to foreign particles.
12.1 Purging before removing the MFC
Before removing the MFC purge the gas lines with nitrogen or argon. The purge gas must be
moisture and oxygen free, to less than one hundred parts per billion. The preferable method
is to cycle purge the line for a period of two to four hours, depending on the cleanliness
required by the process and the reactiveness of the process gas.
Cycle purging consists of evacuating to a low pressure adequate to induce outgassing and
then pur
ging to remove adhered moisture and oxygen. The cycle is repeated several times to
complete the cleaning. Alternatively, eight to twenty-four hours of purging alone may be used
if vacuum is not available.
12.2 Removing the MFC
Once the line has been purged, the MFC can be removed. Inspect the upstream and
downstream lines, as well as the MFC inlet and outlet, for signs of contamination.
Immediately hardcap the inlet and outlet fittings of the MFC and cap the line fittings as well.
The unit should be sealed in a cleanroom plastic bag before leaving the cleanroom area.
12.3 Packaging the MFC
The unit can now be transported to the service or calibration location. If the MFC is to be
transported outside of the facility, it should be packaged in its original carton or 1 inch of
foam cushion on all sides, adequate for shipping an instrument.
Be sure to include documentation of any contamination found, failure symptoms, and the
location of its installation. This documentation can facilitate future contamination analysis.
If a product is being returned to Celerity it must include your company name, contact,
Contaminination Disclosure Form, and RMA #. Call Unit for an RMA # prior to shipping.
12.4 Un-Packaging
When the MFC is received at a service or calibration facility, the bag should be opened only
within a cleanroom area (Class 1000 or better).
12.5 Cleaning
Cleaning of the MFCs should be done with semiconductor grade chemicals. Assembly,
calibration, response timing, and performance testing is to be accomplished in a Class 100 or
better environment.
12.6
Shipping
Once the unit has been cleaned, ser
viced and/or r
ecalibrated, it must be hardcapped and
bagged for r
eturn. Include with the removal documentation any documentation relevant to
the calibration and service that was performed.
12
©2005 Celerity
, Inc.
#199-001-0006 REV
.F 4/05
Artisan Technology Group - Quality Instrumentation ... Guaranteed | (888) 88-SOURCE | www.artisantg.com
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