Particulate contamination Specifications
NOTE: This condition applies to data center and non-
data center environments.
NOTE: Common sources of conductive dust include
manufacturing processes, and zinc whiskers from the
plating on the bottom of raised floor tiles.
Corrosive dust • Air must be free of corrosive dust.
• Residual dust present in the air must have a deliquescent point
less than 60% relative humidity.
NOTE: This condition applies to data center and non-
data center environments.
Table 66. Gaseous contamination specifications
Gaseous contamination Specifications
Copper Coupon Corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver Coupon Corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.
Thermal restriction matrix
Table 67. Thermal restriction matrix for processor and fans
Features, processor type and specifications Configuration type, fan type and ambient temperature support
Storage configuration 4 x 3.5-inch drives 8 x 2.5-inch drives 10 x 2.5-inch drives
(NVMe)
Fan type: Standard fan (STD fan)/ Performance fan (HPR fan)
TDP (W) Processor heat sink (1U):
Standard heat sink (STD
HSK/ Performance heat sink
(HPR HSK)
Ambient = 35°C Ambient = 35°C Ambient = 30°C
225 HPR HSK Yes (HPR fan) Yes (HPR fan) Yes (HPR fan)
200 HPR HSK Yes (STD fan) Yes (STD fan) Yes (HPR fan)
180 HPR HSK Yes (STD fan) Yes (STD fan) Yes (HPR fan)
155 STD HSK Yes (STD fan) Yes (STD fan) Yes (HPR fan)
Table 68. Thermal restriction matrix for T4 GPGPU
Riser configurations Configuration type and ambient temperature support
4 x 3.5-inch drives 8 x 2.5-inch drives 10 x 2.5-inch drives (NVMe)
Fan type: Performance fan (HPR fan)
Ambient = 30°C
Slot 2 HPR fan HPR fan NA
Slot 3 HPR fan HPR fan HPR fan + NVMe drives from slot 6 to
9 + drives from slot 0 to 5
122 Technical specifications
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