ADSP21477KCPZ-1A(IC1401)
ADSP-21477/ADSP-21478/ADSP-21479
Rev. C | Page 73 of 76 | July 2013
OUTLINE DIMENSIONS
The processors are available in 88-lead LFCSP_VQ, 100-lead
LQFP_EP and 196-ball CSP_BGA RoHS compliant packages.
For package assignment by model, see Ordering Guide on
Page 76.
Figure 57. 88-Lead Lead Frame Chip Scale Package [LFCSP_VQ
1
]
(CP-88-5)
Dimensions Shown in Millimeters
1
For information relating to the exposed pad on the CP-88-5 package, see the table endnote on Page 68.
*
COMPLIANT TO JEDEC STANDARDS MO-220-VRRD
EXCEPT FOR MINIMUM THICKNESS AND LEAD COUNT.
1
22
66
45
23
44
88
67
0.50
0.40
0.30
0.30
0.23
0.18
10.50
REF
0.60 MAX
0.60
MAX
6.70
REF SQ
0.50
BSC
0.138~0.194 REF
12° MAX
SEATING
PLANE
TOP VIEW
EXPOSED PAD
BOTTOM VIEW
0.70
0.65
0.60
0.045
0.025
0.005
PIN 1
INDICATOR
12.10
12.00 SQ
11.90
11.85
11.75 SQ
11.65
PIN 1
INDICATOR
*
0.90
0.85
0.75
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COPLANARITY
0.08
Rev. C | Page 68 of 76 | July 2013
ADSP-21477/ADSP-21478/ADSP-21479
88-LFCSP_VQ LEAD ASSIGNMENT
Table 61 lists the 88-Lead LFCSP_VQ package lead names.
Table 61. 88-Lead LFCSP_VQ Lead Assignments (Numerical by Lead Number)
Lead Name Lead No. Lead Name Lead No. Lead Name Lead No. Lead Name Lead No.
CLK_CFG1 1 V
DD_EXT
23 DAI_P10 45 V
DD_INT
67
BOOT_CFG0 2 DPI_P08 24 V
DD_INT
46 FLAG0 68
V
DD_EXT
3 DPI_P07 25 V
DD_EXT
47 V
DD_INT
69
V
DD_INT
4 DPI_P09 26 DAI_P20 48 FLAG1 70
BOOT_CFG1 5 DPI_P10 27 V
DD_INT
49 FLAG2 71
GND 6 DPI_P11 28 DAI_P08 50 FLAG3 72
CLK_CFG0 7 DPI_P12 29 DAI_P04 51 GND 73
V
DD_INT
8 DPI_P13 30 DAI_P14 52 GND 74
CLKIN 9 DAI_P03 31 DAI_P18 53 V
DD_EXT
75
XTAL 10 DPI_P14 32 DAI_P17 54 GND 76
V
DD_EXT
11 V
DD_INT
33 DAI_P16 55 V
DD_INT
77
V
DD_INT
12 DAI_P13 34 DAI_P15 56 TRST 78
V
DD_INT
13 DAI_P07 35 DAI_P12 57 EMU 79
RESETOUT
/RUNRSTIN 14 DAI_P19 36 DAI_P11 58 TDO 80
V
DD_INT
15 DAI_P01 37 V
DD_INT
59 V
DD_EXT
81
DPI_P01 16 DAI_P02 38 GND 60 V
DD_INT
82
DPI_P02 17 V
DD_INT
39 THD_M 61 TDI 83
DPI_P03 18 V
DD_EXT
40 THD_P 62 TCK 84
V
DD_INT
19 V
DD_INT
41 V
DD_THD
63 V
DD_INT
85
DPI_P05 20 DAI_P06 42 V
DD_INT
64 RESET 86
DPI_P04 21 DAI_P05 43 V
DD_INT
65 TMS 87
DPI_P06 22 DAI_P09 44 V
DD_INT
66 V
DD_INT
88
GND 89*
* Lead no. 89 is the GND supply (see Figure 53 and Figure 54) for the processor; this pad must be robustly connected to GND in order for the
processor to function.
64
To Next Page
Loading...
