Ebyte E22-400T30S - 11.3 BER(Bit Error Rate) is high; 12. Production guidance; 12.1 Reflow soldering temperature

Chengdu Ebyte Electronic Technology Co., Ltd. E22-400T30S User manual
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd.
22
⚫ Please check the stability of power source, the voltage cannot fluctuate too much.
⚫ Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic
susceptibility.
⚫ Please ensure the humidity is within limited range, some parts are sensitive to humidity.
⚫ Please avoid using modules under too high or too low temperature.
11.3 BER(Bit Error Rate) is high
⚫ There are co-channel signal interference nearby, please be away from interference sources or modify
frequency and channel to avoid interference;
⚫ Poor power supply may cause messy code. Make sure that the power supply is reliable.
⚫ The extension line and feeder quality are poor or too long, so the bit error rate is high;
12 Production guidance
12.1 Reflow soldering temperature
Profile Feature
Curve characteristics
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
Min preheating temp.
100℃
150℃
Preheat temperature max (Tsmax)
Mx preheating temp.
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average ramp-up rate
3℃/second max
3℃/second max
Liquidous Temperature (TL)
Liquid phase temp.
183℃
217℃
Time（tL）Maintained Above（TL）
Time below liquid phase line
60-90 sec
30-90 sec
Peak temperature（Tp）
Peak temp.
220-235℃
230-250℃
Aveage ramp-down rate（Tp to Tsmax）
Aveage ramp-down rate
6℃/second max
6℃/second max
Time 25℃ to peak temperature
Time to peak temperature for
25℃
max 6 minutes
max 8 minutes