Ebyte E220-900T30D - Soldering Operation Guidance; Reflow Soldering Temperature; Reflow Soldering Curve

Chengdu Ebyte Electronic Technology Co., Ltd. E220-900T30D User Manual
Copyright ©2012–2020, Chengdu Ebyte Electronic Technology Co.,Ltd.
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11. Soldering Operation Guidance
11.1 Reflow Soldering Temperature
Table 11-1 Register description
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
100℃
150℃
Preheat temperature max (Tsmax)
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
3℃/second max
3℃/second max
Liquidous Temperature (TL)
183℃
217℃
Time
（
tL
）
Maintained Above
（
TL
）
60-90 sec
30-90 sec
Peak temperature（Tp）
220-235℃
230-250℃
Aveage ramp-down rate（Tp to Tsmax）
6℃/second max
6℃/second max
Time 25℃ to peak temperature
6 minutes max
8 minutes max
11.2 Reflow Soldering Curve