EMC VNX5300 - Disk-Array Enclosure Expansion; 3 U, 15 (3.5-inch) DAE; 2 U, 25 (2.5-inch) DAE

Disk-array enclosure expansion
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EMC® VNX5300™ Hardware Information Guide
Disk-array enclosure expansion
The Block and File VNX5300 platform supports the expansion of two types of
disk-array enclosures (DAEs) across a 6-Gb/s SAS bus:
◆ 3U, 15 (3.5-inch) DAE
◆ 2U, 25 (2.5-inch) DAE
The Block and File VNX5300 platform supports up to seven 3U, 15 (3.5-inch) DAEs
(120 3.5-inch disk drives) or up to four 2U, 25 (2.5-inch) DAEs (125 2.5-inch disk
drives).
IMPORTANT
!
When calculating the number of drives for your system, the DPE is included in the
total drive slot quantity of up to 125 drives. If the total drive slot quantity exceeds
125, you will not be able to add another DAE. Refer to “Overview” on page 3 for
more information about the Block and File VNX5300 platform DPEs.
Each DAE consists of the following components:
◆ Drive carrier
◆ Disk drives
◆ Midplane
◆ Link control cards (LCCs)
◆ Power supply/cooling modules
◆ EMI shielding
Drive carrier The disk drive carriers are metal and plastic assemblies that provide smooth, reliable
contact with the enclosure slot guides and midplane connectors. Each carrier has a
handle with a latch and spring clips. The latch holds the disk drive in place to ensure
proper connection with the midplane. Disk drive activity/fault LEDs are integrated
into the carrier (Figure 56 on page 59 and Figure 63 on page 66).
Disk drives Each disk drive consists of one disk drive in a carrier. You can visually distinguish
between module types by their different latch and handle mechanisms and by type,
capacity, and speed labels on each module. You can add or remove a disk drive while
the DAE is powered up, but you should exercise special care when removing
modules while they are in use. Drive modules are extremely sensitive electronic
components.
Midplane A midplane separates the front-facing disk drives from the rear-facing LCCs and
power supply/cooling modules. It distributes power and signals to all components in
the enclosure. LCCs, power supply/cooling modules, and disk drives plug directly
into the midplane.
LCCs An LCC supports, controls, and monitors the DAE, and is the primary interconnect
management element. Each LCC includes connectors for input and expansion to
downstream devices. An enclosure address (EA) indicator is located on each LCC
(Figure 62 on page 65 and Figure 69 on page 72)
15
. Each LCC includes a bus (loop)
identification indicator (Figure 62 on page 65 and Figure 69 on page 72).
15. The EA is sometimes referred to as an enclosure ID.