FLIR Lepton 1.6 User Manual

FLIR LEPTON® Engineering Datasheet
The information contained herein does not contain technology as defined by the EAR, 15 CFR 772, is publicly available,
and therefore, not subject to EAR. NSR (6/14/2018).
Information on this page is subject to change without notice.
Lepton Engineering Datasheet, Document Number: 500-0659-00-09 Rev: 203
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General Description
Lepton® is a complete long-wave infrared
(LWIR) camera module designed to interface
easily into native mobile-device interfaces and
other consumer electronics. It captures infrared
radiation input in its nominal response
wavelength band (from 8 to 14 microns) and
outputs a uniform thermal image with
radiometry
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to provide temperature image with
measurements.
Lepton Features
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• Integral shutter configurations
• Configurations with 25°, 50° and 57°
HFOV (f/1.1 silicon doublet)
• LWIR sensor, wavelength 8 to 14 µm
• Arrays with 80x60 and 160x120 active
pixels available
• Thermal sensitivity <50 mK
• Integrated digital thermal image
processing functions, including
automatic thermal environment
compensation, noise filters, non-
uniformity correction, and gain control
• Radiometric accuracy
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(35°C blackbody)
o High gain: ±5C @ 25°C
o Low gain ±10C @ 25°C
• Radiometric Leptons
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feature
temperature measurement including
per pixel and frame radiometric output
(TLinear) and Spotmeter
• Export compliant frame rate (< 9 Hz)
• SPI video interface
• Two-wire I2C serial control interface
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Radiometric Leptons are 2.5 and 3.5.
• Uses standard cell-phone-compatible
power supplies: 2.8 V to sensor, 1.2 V to
digital core, and flexible IO from 2.8 V
to 3.1 V
• Fast time to image (< 1.2 sec)
• Low operating power
o Nominally 160 mW
o 800mW typical during shutter
event (~1s)
o Low power mode 5 mW
• RoHS compliant
• 32- pin socket interface to standard
Molex or similar side-contact connector
Applications
• Mobile phones
• Gesture recognition
• Building automation
• Thermal imaging
• Night vision
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All specifications subject to change without notice

FLIR Lepton 1.6 Specifications

General

Resolution	80 x 60 pixels
Thermal Sensitivity	<50 mK
Interface	SPI
Operating Temperature	-10 °C to +80 °C
Weight	0.5 g
Spectral Range	8 to 14 μm
Power Consumption	150 mW
Storage Temperature	-40 °C to +85 °C
Input Voltage	2.8 V

Summary

General Description

Lepton Features

Lists key features of the Lepton camera module, including integral shutter and sensor capabilities.

Applications

Outlines various use cases and applications for the Lepton camera, such as mobile phones and gesture recognition.

Introduction

Revision History

Records changes and updates made to the datasheet over time.

Contact Us

Provides contact information for FLIR support and inquiries.

References

Lists related documents and resources for further technical information.

Device Overview

Provides a general introduction to the Lepton camera system and its capabilities.

Key Specifications

Details the main technical specifications for various Lepton configurations.

System Architecture

Describes the overall architectural block diagram of the Lepton camera module.

Functional Description

FPA Interface Module

Explains the interface between the Focal Plane Array and the system chip.

System Control (Sys Ctrl) Module

Details the module responsible for clocks, resets, and system control.

Power Management Module

Describes the module that controls power switches within the Lepton.

Software-based Video Processing (SVP Core) Module

Explains the DSP engine for video processing and the full video pipeline.

Memory System (Memory Sys) Module

Details the memory interface to other modules.

General Purpose Processor (GPP)

Describes the central processing unit and its functions.

Video Interface Module (Video IF)

Explains how video data is received and formatted.

One-Time Programmable Memory (OTP)

Covers the non-volatile memory for configuration and data.

Static Random-Access Memory (SRAM)

Describes the volatile memory used by other modules.

GPIO Interface Module (GPIO IF)

Details the General-Purpose Input/Output interface module.

Video Pipeline

Details the image processing steps including NUC, defect replacement, and filtering.

Operating States and Modes

Power States

Lists and describes the five different power states of the Lepton camera.

FFC States

Explains the different states related to Flat Field Correction.

Gain States

Describes the different gain modes available for Lepton configurations.

Telemetry Modes

Details the three modes affecting the video output signal's telemetry data.

Radiometry Modes

Outlines options for radiometry modes affecting the video output signal.

AGC Modes

Explains the two Automatic Gain Control modes and their function.

Video Output Format Modes

Describes the two available video output format modes.

GPIO Modes

Details the two supported modes for the General-Purpose Input/Output pins.

Interface Descriptions

Command and Control Interface

Describes the CCI for controlling Lepton via a two-wire interface.

VoSPI Channel

Explains the VoSPI protocol for efficient video data transfer over SPI.

Thermal Camera Basics

Detector Time Constant

Discusses the detector's time constant and its impact on image formation.

Mounting Specifications

Socket Information

Details compatible sockets for mounting the Lepton module.

Mechanical Considerations

Covers aspects of physical integration and retention under shock conditions.

Image Characteristics

NETD

Specifies the Noise Equivalent Temperature Difference, a key performance metric.

Intra-scene Range

Defines the minimum and maximum scene temperatures for different gain modes.

Spectral Response

Normalized Response

Illustrates the typical spectral response of the Lepton camera over wavelength.

Electrical Specifications

Lepton pin-out

Provides a diagram showing the pin assignments of the Lepton camera module.

DC and Logic Level Specifications

Lists the DC voltages and logic level parameters for the Lepton.

AC Electrical Characteristics

Details the timing and frequency characteristics for clock and data signals.

Absolute Maximum Ratings

Outlines electrical stress limits to prevent permanent device damage.

Electronic integration considerations

Provides guidance on integrating the Lepton module into a PCB.

Environmental Specifications

Environmental Specifications

Lists operating and storage temperature, humidity, and shock ratings.

Abbreviations and Acronyms

Abbreviations and Acronyms

A glossary of technical terms and acronyms used in the document.