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General| Communication Interface | USB |
|---|---|
| Resolution | 0.1 °C/°F |
| Data Storage | Internal memory |
| Sampling Rate | Up to 10 readings per second |
| Software Compatibility | Datapaq Insight Software |
| Storage Temperature | -20 °C to +85 °C (-4 °F to +185 °F) |
Details the essential parts of a typical Reflow Tracker system.
Explains the function and types of thermal barriers for logger protection.
Details specifications for various Datapaq DP5 and Q18 logger thermal barriers.
Covers principles, types, specifications, and cables of thermocouple probes.
Discusses probe positioning, attachment methods, and cable management.
Steps for preparing the logger, installing in barrier, and placing in the oven.
Covers profile types, analysis, fault checking, and statistical process control.
Guide to running, preparing, and analyzing wave-solder temperature profiles.
Using Easy Oven Setup for predicting and refining oven profiles and recipes.
Assembling solder paste data to form the basis for prediction.
Common reasons for poor predictions in oven setup.
Details Surveyor hardware, carrier frame, sensors, and preparation for runs.
Conducting baseline surveys, setting tolerances, and performing profile runs.
Understanding Surveyor Index and using SPC for trend prediction.
Procedures for checking data validity and testing logger/thermocouples.
Contact information for Datapaq Service Department.
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