HI 800 101 HIMatrix Engineering Manual
5.3.2 Mounting of HIMA Field Bus Communication Modules.............33
5.3.2.1 System Requirements...............................................................33
5.3.2.2 Display of the actual Versions of the Operating Systems.........33
5.4 Wiring..............................................................................................34
5.4.1 Safeethernet, Ethernet ..............................................................34
5.4.1.1 Interface Elements....................................................................35
5.4.1.2 Specified Cables.......................................................................35
5.4.1.3 RJ 45 Connector.......................................................................36
5.4.1.4 Switches....................................................................................38
5.4.2 Field Buses................................................................................39
5.4.2.1 Fundamentals of RS-485 Transfer Mode System ....................39
5.4.2.2 PROFIBUS DP..........................................................................39
5.4.2.3 MODBUS Master/Slave Communication..................................40
5.4.2.4 INTERBUS................................................................................41
6 Labeling...............................................................................................41
6.1.1 Equipment Identification............................................................41
7 Configuration of the Software...........................................................42
7.1 Supported Data Types....................................................................42
7.2 Line Monitoring ...............................................................................42
7.2.1 Required Signals.......................................................................43
7.2.2 Configuration for Pulsed Outputs..............................................44
7.2.3 Configuration Example..............................................................45
7.2.3.1 Principle Method of Signal Assignment ....................................45
7.2.3.2 Configuring the Pulsed Outputs and Assignment to the Inputs45
7.2.3.3 Assignment of the Signals to the Inputs and their Error Codes46
7.2.3.4 Activation of the Pulsed Outputs...............................................46
7.3 Line Monitoring at HIMatrix F35......................................................46
7.4 Line Monitoring at F3 DIO 16/8 01..................................................51
7.4.1 Parameterization of Line Monitoring at 2-Pole Connection.......51
7.4.1.1 Line Monitoring for Lamp Loads and Inductive Loads..............53
7.4.1.2 Line Monitoring with Reduced Voltage for Resistive,
Capacitive Loads ......................................................................54
7.4.1.3 2-Pole Connection with Common Reference Pole
(3-Pole Connection)..................................................................54
7.4.2 Table of Configurations for Digital Outputs ...............................55
8 Commissioning, Maintenance, Repairs ...........................................56
8.1 Testing the Inputs and Outputs for Interference Voltage
and Earth Faults..............................................................................56
8.2 Modifications ...................................................................................56
8.3 Replacement of Modules ................................................................57
8.4 Maintenance ...................................................................................57
8.5 Replacement of Back-up Batteries .................................................57
8.6 Repair of Controllers and Modules .................................................58
8.7 Supply of Internal Documentation...................................................58
9 Operating Conditions.........................................................................59
9.1 Climatic Conditions .........................................................................59
9.2 Mechanical Conditions....................................................................60
9.3 EMC Conditions..............................................................................60
9.4 Voltage Supply................................................................................61
7 of 61