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HP 240 G2 User Manual

HP 240 G2
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Drive handling
CAUTION: Drives are fragile components that must be handled with care. To prevent damage to the
computer, damage to a drive, or loss of information, observe these precautions:
Before removing or inserting a hard drive, shut down the computer. If you are unsure whether the computer
is off or in Hibernation, turn the computer on, and then shut it down through the operating system.
Before handling a drive, be sure that you are discharged of static electricity. While handling a drive, avoid
touching the connector.
Before removing a diskette drive or optical drive, be sure that a diskette or disc is not in the drive and be sure
that the optical drive tray is closed.
Handle drives on surfaces covered with at least one inch of shock-proof foam.
Avoid dropping drives from any height onto any surface.
After removing a hard drive, an optical drive, or a diskette drive, place it in a static-proof bag.
Avoid exposing an internal hard drive to products that have magnetic fields, such as monitors or speakers.
Avoid exposing a drive to temperature extremes or liquids.
If a drive must be mailed, place the drive in a bubble pack mailer or other suitable form of protective
packaging and label the package “FRAGILE.”
Grounding guidelines
Electrostatic discharge damage
Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure
determine the degree of sensitivity. Networks built into many integrated circuits provide some protection,
but in many cases, ESD contains enough power to alter device parameters or melt silicon junctions.
A discharge of static electricity from a finger or other conductor can destroy static-sensitive devices or
microcircuitry. Even if the spark is neither felt nor heard, damage may have occurred.
An electronic device exposed to ESD may not be affected at all and can work perfectly throughout a normal
cycle. Or the device may function normally for a while, then degrade in the internal layers, reducing its life
expectancy.
CAUTION: To prevent damage to the computer when you are removing or installing internal components,
observe these precautions:
Keep components in their electrostatic-safe containers until you are ready to install them.
Before touching an electronic component, discharge static electricity by using the guidelines described in this
section.
Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible.
If you remove a component, place it in an electrostatic-safe container.
The following table shows how humidity affects the electrostatic voltage levels generated by
different activities.
CAUTION: A product can be degraded by as little as 700 V.
40 Chapter 4 Removal and replacement procedures

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HP 240 G2 Specifications

General IconGeneral
Form factorClamshell
Product typeLaptop
Product colorBlack
Country of originChina
Bus typeDMI
SteppingL1
Tjunction90 °C
Processor cache3 MB
Processor cores2
Processor modeli3-3110M
System bus rate5 GT/s
Processor familyIntel® Core™ i3
Processor seriesIntel Core i3-3100 Mobile Series
Processor socketBGA 1023
Processor threads4
Processor codenameIvy Bridge
Processor frequency2.4 GHz
Processor cache typeSmart Cache
Processor lithography22 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version2.0
Processor operating modes64-bit
ECC supported by processorNo
PCI Express configurations1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)35 W
CPU multiplier (bus/core ratio)24
Maximum number of PCI Express lanes16
Motherboard chipsetIntel HM76 Express
Memory slots2x SO-DIMM
Internal memory4 GB
Memory clock speed1600 MHz
Memory form factorSO-DIMM
Internal memory typeDDR3-SDRAM
Maximum internal memory- GB
Memory layout (slots x size)1 x 4 GB
HDD speed5400 RPM
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD Super Multi DL
Card reader integratedYes
Total storage capacity500 GB
Compatible memory cardsSD
Number of HDDs installed1
Display surface-
Display diagonal14 \
Display resolution1366 x 768 pixels
Native aspect ratio16:9
On-board graphics card ID0x166
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 4000
On-board graphics card familyIntel® HD Graphics
On-board graphics card base frequency650 MHz
On-board graphics card dynamic frequency (max)1000 MHz
Front camera resolution1280 x 720 pixels
Wi-Fi standards802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version4.0
Ethernet LAN data rates10, 100, 1000 Mbit/s
Charging port typeDC-in jack
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
eSATA/USB 2.0 ports quantity0
Pointing deviceTouchpad
Operating system installedWindows 8.1
Processor codeSR0N2
Processor ARK ID65700
Processor package size37.5 x 37.5 (rPGA988B); 31 x 24 (BGA1023) mm
Supported instruction setsAVX
Intel Identity Protection Technology version1.00
Battery capacity41 Wh
Battery life (max)- h
AC adapter power65 W
Sustainability certificatesENERGY STAR
Weight and Dimensions IconWeight and Dimensions
Depth240 mm
Width346 mm
Height28.1 mm
Weight2200 g

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