Model 3720A
b. Do'not use
a
high-power soldering iron on
etched circuit boards. Excessive heat may lift
a
conductor
or
damage the board. A
40
watt solder-
ing iron
is
sufficient.
c.
Use
a
suction device, eg, Soldapult,
or
wooden
toothpick to remove solder from component
mounting holes. Care must
be
i3ken when clear-
ing out component mounting holes; never use
sharp metal objects, such
as
an awl
or
a
twist-drill,
which could damage the plated-through conductor.
d. After soldering, remove
excess
flux from the
soldered areas with
a
soac and water solution.
e.
When removing
a
multiple connection com-
ponent, such
as
an integrated circuit, loosen
it gradually, using
a
gentle side-to-side motion,
to avoid damage to the plated-through conductors.
2-36
Integrated Circuit Removal/Replacement
2-37 There are three recommended methods of
removing integrated circuit packages from
a
printed
circuit board:
a.
Solder Gobbler.
This
is
the best method.
Solder
is
removed from the board by
a
soldering
iron with
a
hollow tip connected to
a
vacuum
source. This permits an
IC
to be removed intact
so
that
it
may be replaced if an error has been
made in diagnosis.
b.
Desoldering
Tool.
(Soldapult
-
hp
Part
No.
8690-0060).
This method
is
recommended if
a
vacuum operated Solder Gobbler
is
not available.
Remove the solder from each lead by using the
soldering iron and the desoldering tool together.
c.
Clip
Out.
This is the
least
satisfactory of the
three methods. Clip the leads
as
close to the case
as
possible.
With
a
soldering iron and long nose
pliers carefully remove the leads from each hole.
2-6
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