HP Chromebox G2 - User Manual

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Template Revision B

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Product End-of-Life Disassembly Instructions

Product Category: Other Products

Marketing Name / Model

[List multiple models if applicable.]

HP Chromebox G2

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

M/B, Power/B

Batteries

All types including standard alkaline and lithium

coin or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Power cord

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

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HP Chromebox G2 Specifications

General

Bus type	OPI
Tjunction	100 °C
Processor cache	2 MB
Processor cores	2
System bus rate	4 GT/s
Processor family	Intel® Celeron®
Processor codename	Kaby Lake
Processor frequency	1.8 GHz
Processor cache type	Smart Cache
Configurable TDP-down	10 W
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	2.0
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x2+2x1, 1x4, 2x2, 4x1
Thermal Design Power (TDP)	15 W
Number of processors installed	1
Maximum number of PCI Express lanes	10
Memory types supported by processor	DDR3L-SDRAM, DDR4-SDRAM, LPDDR3-SDRAM
Memory clock speeds supported by processor	1600, 1866, 2133 MHz
Memory bandwidth supported by processor (max)	34.1 GB/s
Maximum internal memory supported by processor	32 GB
Memory slots	2x SO-DIMM
Internal memory	4 GB
Memory channels	Dual-channel
Memory clock speed	2400 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	16 GB
Memory layout (slots x size)	1 x 4 GB
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
SSD interface	SATA
Storage media	SSD
Card reader integrated	Yes
Compatible memory cards	MicroSD (TransFlash)
On-board graphics card ID	0x5906
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 610
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	300 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	900 MHz
Number of displays supported (on-board graphics)	3
Antenna type	2x2
Bluetooth version	4.2
Cabling technology	10/100/1000Base-T(X)
Top Wi-Fi standard	Wi-Fi 5 (802.11ac)
Ethernet LAN data rates	10, 100, 1000 Mbit/s
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity	0
Chassis type	Mini PC
Product color	Black
Country of origin	China
Cable lock slot type	Kensington
Operating system installed	ChromeOS
Power supply	65 W
Sustainability certificates	ENERGY STAR
Processor ARK ID	96507
Processor package size	42 x 24 mm
Supported instruction sets	SSE4.1, SSE4.2
Intel Secure Key Technology version	1.00
Intel Stable Image Platform Program (SIPP) version	0.00