Technology and architecture of HP ProLiant Intel-
based 300–series G6 (Generation 6) servers
Technology brief
Abstract.............................................................................................................................................. 3
Introduction......................................................................................................................................... 3
Intel Xeon 5500 Series processor technology .......................................................................................... 3
Multi-level caches............................................................................................................................. 3
Integrated memory controller ............................................................................................................. 4
QuickPath Interconnect controller ....................................................................................................... 4
Hyper Threading.............................................................................................................................. 5
Turbo Boost technology..................................................................................................................... 6
Memory.............................................................................................................................................. 6
DDR-3............................................................................................................................................. 6
DIMM Choices............................................................................................................................. 7
Memory Mirroring with DDR3........................................................................................................ 8
Memory channel interleaving......................................................................................................... 9
I/O technologies ................................................................................................................................. 9
PCI Express technology..................................................................................................................... 9
HP Smart Array and SAS/SATA technology ...................................................................................... 10
SAS-2 ....................................................................................................................................... 10
New generation HP Smart Array controllers .................................................................................. 11
Battery backed write cache ......................................................................................................... 11
Zero Memory RAID..................................................................................................................... 11
Smart Array Advanced Pack (SAAP) ............................................................................................. 11
Software RAID ........................................................................................................................... 12
Networking technologies ................................................................................................................ 12
Power and thermal technologies .......................................................................................................... 13
Efficient power delivery................................................................................................................... 13
Common slot power supplies ....................................................................................................... 13
Increasing power efficiency in redundant power operation.............................................................. 14
Voltage regulation...................................................................................................................... 14
Improved thermal sensors and fan control ......................................................................................... 14
Dynamic Power Capping ................................................................................................................ 15
Phase shedding ............................................................................................................................. 16
Phase shedding based on the installed processor ........................................................................... 16
Memory phase shedding............................................................................................................. 16
Dynamic CPU phase shedding..................................................................................................... 17
Managing processor technologies.................................................................................................... 17
QuickPath Interconnect power...................................................................................................... 17
Disabling processor cores............................................................................................................ 17
Minimum processor idle power state............................................................................................. 17
Managing memory technologies ...................................................................................................... 17
Memory channel interleaving....................................................................................................... 17
Maximum memory data rates.......................................................................................................17
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