HP EliteBook 820 G4 Maintenance And Service Guide

System board
NOTE: All system board spare part kits include replacement thermal material.
All system boards use the following part numbers:
xxxxxx-001: Non-Windows operating systems
xxxxxx-601: Windows operating system
Description Spare part number
System board, includes Intel i7-7600U 914274-xxx
System board, includes Intel i7-7500U 914273-xxx
System board, includes Intel i5-7300U 914272-xxx
System board, includes Intel i5-7200U 914271-xxx
System board, includes Intel i3-7100U 914270-xxx
Before removing the system board, follow these steps:
1. Shut down the computer. If you are unsure whether the computer is o or in Hibernation, turn the
computer on, and then shut it down through the operating system.
2. Disconnect all external devices connected to the computer.
3. Disconnect the power from the computer by rst unplugging the power cord from the AC outlet, and
then unplugging the AC adapter from the computer.
4. Remove the bottom cover (see Bottom cover on page 30).
5. Remove the battery (see Battery on page 35).
6. Remove the following components:
a. Keyboard (see Keyboard on page 46)
b. Hard drive (see Hard drive on page 36)
c. Solid-state drive (see Solid-state drive on page 38)
When replacing the system board, be sure to remove the following components from the defective system
board and install on the replacement system board:
●
Memory modules (see Memory modules on page 40)
●
WLAN/Bluetooth module (see WLAN/Bluetooth combo card on page 42)
●
WWAN module (see WWAN module on page 44)
●
Heat sink/fan assembly (see Heat sink/fan assembly on page 56)
Remove the system board:
1. Position the computer upright and open.
Component replacement procedures 61

HP EliteBook 820 G4 Specifications

General

Form factor	Clamshell
Product type	Laptop
Product color	Black, Silver
Country of origin	China
Panel type	UWVA
LED backlight	Yes
Display surface	Matt
Display diagonal	12.5 \
Native aspect ratio	16:9
Maximum internal memory (64-bit)	32 GB
Memory slots	2x SO-DIMM
Internal memory	8 GB
Memory clock speed	2133 MHz
Memory form factor	SO-DIMM
Internal memory type	DDR4-SDRAM
Memory layout (slots x size)	1 x 8 GB
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
Storage media	SSD
SSD form factor	M.2
Total storage capacity	256 GB
Compatible memory cards	SD, SDHC, SDXC
Number of SSDs installed	1
On-board graphics card ID	0x5916
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 620
On-board graphics card family	Intel® HD Graphics
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	300 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1000 MHz
Number of built-in speakers	2
Front camera signal format	720p
4G standard	LTE
3G standards	EVDO, HSPA+
Wi-Fi standards	802.11a, Wi-Fi 5 (802.11ac), 802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version	4.2
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Mobile network generation	4G
Charging port type	DC-in jack
USB 2.0 ports quantity	0
Pointing device	Touchpad
Operating system architecture	64-bit
HP segment	Business
HP Security tools	HP Device Access Manager, HP BIOSphere, HP Sure Start Gen3, HP Client Security Gen3
HP Management tools	HP Driver Packs, HP SoftPaq Download Manager (SDM), HP System Software Manager (SSM), HP BIOS Config Utility (BCU), HP Client Catalog, HP Management Integration Kit for Microsoft System Center Configuration Manager
HP Software provided	HP Hotkey Support, HP Noise Cancellation, HP Workwise, HP Velocity, HP Image Assistant
Battery capacity	49 Wh
Number of battery cells	3
AC adapter power	45 W
Operating altitude	-15 - 3048 m
Non-operating altitude	-15 - 12192 m
Storage temperature (T-T)	-20 - 60 °C
Operating temperature (T-T)	5 - 35 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 90 %
Bus type	OPI
Stepping	H0
Tjunction	100 °C
Processor cache	3 MB
System bus rate	4 GT/s
Processor family	Intel® Core™ i5
Processor socket	BGA 1356
Processor threads	4
Processor codename	Kaby Lake
Configurable TDP-up	25 W
Processor frequency	2.5 GHz
Processor cache type	Smart Cache
Configurable TDP-down	7.5 W
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	3.1 GHz
PCI Express configurations	1x2+2x1, 1x4, 2x2, 4x1
Thermal Design Power (TDP)	15 W
Configurable TDP-up frequency	2.7 GHz
Configurable TDP-down frequency	0.8 GHz
Maximum number of PCI Express lanes	12
Processor code	SR2ZU
Processor ARK ID	95443
Processor package size	42 x 24 mm
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Intel Identity Protection Technology version	1.00
Intel Stable Image Platform Program (SIPP) version	0.00

Weight and Dimensions

Depth	218.9 mm
Width	310 mm
Height	18.9 mm
Weight	1260 g