3. Remove the fan/heat sink assembly (3).
NOTE: Due to the adhesive quality of the thermal material located between the fan/heat sink
assembly and the system board components, it may be necessary to move the fan/heat sink assembly
from side to side to detach it.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly
and the system board each time the fan/heat sink assembly is removed. Replacement thermal material is
included with the fan/heat sink assembly and system board spare part kits. Thermal paste is used on
the system board (1) and the section of the fan/heat sink assembly (2) that services it.
Reverse this procedure to install the fan/heat sink assembly.
54 Chapter 6 Removal and replacement procedures for Authorized Service Provider parts
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