5. Remove the fan/heat sink assembly (4).
NOTE: Due to the adhesive quality of the thermal material located between the fan/heat sink
assembly and the system board components, it may be necessary to move the fan/heat sink
assembly from side to side to detach it.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink
assembly and the system board components each time the fan/heat sink assembly is removed.
Replacement thermal material is included with the fan/heat sink assembly, system board, and
processor spare part kits. Thermal paste is used on the processor (1) and the fan/heat sink
assembly section (2) that services it.
Reverse this procedure to install the fan/heat sink assembly.
58 Chapter 4 Removal and replacement procedures
This manual downloaded from http://www.manualowl.com
To Next Page
Loading...
