HP Envy TouchSmart 23 All-in-One - User Manual

Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP Envy TouchSmart 23 All-in-One PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
Mother Board, USB Board, Power Board, Touchpad
Module, TP Board, WLAN Card, RAM Module (x2)
8
Batteries
All types including standard alkaline and lithium coin
or button style batteries RTC Battery
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps Touch LCD display
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
0
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01

Summary

Items Requiring Selective Treatment

Tools Required

Product Disassembly Process

Disassembly Ram Door

Instructions for disassembling the RAM door, including unlocking the latch on both sides.

Disassembly HDD & Dongle

Instructions for disassembling the Hard Disk Drive (HDD) and Dongle.

Disassembly Ram Shielding

Procedure for removing the RAM shielding from the computer.

Disassembly DDR Ram*2

Instructions for removing two DDR RAM modules.

Disassembly Rear cover sub assay

Steps to disassemble the rear cover assembly.

Disassembly Camera Module, PCB modules

Instructions for disassembling camera modules and other PCB modules.

Disassembly Thermal module Fan

Procedure for removing the thermal module fan.

Disassembly Mother board shielding

Steps for removing the motherboard shielding.

Disassembly WLAN Card

Instructions for removing the Wireless Local Area Network (WLAN) card.

Disassembly Thermal module

Procedure for disassembling the thermal module.

Disassembly CPU

Instructions for removing the Central Processing Unit (CPU).

Disassembly Hinge Cap L&R

Procedure for disassembling the left and right hinge caps.

Disassembly Stand unit

Instructions for disassembling the stand unit.

Disassembly Support bridge

Steps to disassemble the support bridge.

Disassembly Mother Board + USB 3.0 PCB and RTC battery

Instructions for removing the motherboard, USB 3.0 PCB, and RTC battery.

Disassembly Separate the USB 3.0 PCB from M;B

Procedure to separate the USB 3.0 PCB from the Motherboard.

Disassembly Speaker left & right side

Instructions for disassembling the left and right speakers.

Disassembly Base Pan sub assay

Steps for disassembling the base pan sub-assembly.

Disassembly Loosen FPC

Procedure for loosening the Flexible Printed Circuit (FPC).

Disassembly LCD Panel

Instructions for disassembling the Liquid Crystal Display (LCD) panel.

Overview

This document outlines the disassembly procedures for the HP Envy TouchSmart 23 All-in-One PC, primarily for end-of-life recyclers and treatment facilities. Its core function is to provide a structured guide for the selective removal of components and materials that require special handling according to the EU directive 2002/96/EC on Waste Electrical and Electronic Equipment (WEEE). The instructions are designed to ensure that hazardous or valuable materials are properly segregated and processed, minimizing environmental impact and facilitating resource recovery.

The device itself, an All-in-One PC, integrates the computer's internal components directly into the display, offering a compact and streamlined desktop solution. This design typically includes a large touchscreen display, which is a key feature for user interaction. The "TouchSmart" designation indicates its capability for touch input, enhancing usability for various applications, from casual browsing to more interactive tasks. The "Envy" branding suggests a focus on premium design and performance, often incorporating higher-quality materials and more powerful internal specifications compared to standard models. As an All-in-One, it aims to reduce cable clutter and save space, making it suitable for environments where a traditional tower setup might be cumbersome.

From a usage perspective, the HP Envy TouchSmart 23 is designed for a broad range of applications, including home entertainment, productivity, and creative work. Its large display is conducive to media consumption, offering an immersive viewing experience for movies, photos, and games. The touch functionality allows for intuitive navigation and interaction with software, making it accessible for users who prefer a more direct interface than a mouse and keyboard alone. For productivity, the integrated design and powerful components support multitasking and running demanding applications. The inclusion of a webcam and microphone, typical for All-in-One PCs, facilitates video conferencing and online communication. The device's connectivity options, such as USB ports and Wi-Fi, ensure seamless integration with peripherals and networks. The "23" in its name likely refers to the screen size, indicating a substantial display area for comfortable viewing and interaction.

Maintenance features, as implied by the disassembly instructions, are primarily geared towards end-of-life processing rather than routine user maintenance. The detailed steps for removing various internal components highlight the complexity of the device's construction. For instance, the instructions cover the disassembly of the RAM door, HDD and dongle, RAM shielding, DDR RAM, rear cover sub-assembly, camera module, PCB modules, thermal module fan, motherboard shielding, WLAN card, thermal module, CPU, hinge cap, stand unit, support bridge, motherboard, USB 3.0 PCB, RTC battery, speakers, base pan sub-assembly, FPC, and LCD panel. This comprehensive breakdown suggests that while the device is designed for integrated performance, its internal architecture is modular enough to allow for component-level recycling and repair by trained technicians. The emphasis on selective treatment of specific items like printed circuit boards, batteries, mercury-containing components, LCDs, and plastics containing brominated flame retardants underscores the device's adherence to environmental regulations. The requirement for specific tools, such as a TORX T8 screwdriver, indicates that specialized equipment is needed for proper disassembly, further reinforcing that these procedures are not intended for the average end-user. The detailed graphical illustrations accompanying each disassembly step serve as a visual guide, ensuring accuracy and efficiency in the removal process, which is crucial for both recycling and potential component reuse. This level of detail is essential for ensuring that all materials requiring selective treatment are identified and handled correctly, contributing to a more sustainable product lifecycle.

HP Envy TouchSmart 23 All-in-One Specifications