refractory ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Disassembly Ram Door
2. Disassembly HDD & Dongle
3. Disassembly Ram Shielding
4. Disassembly DDR Ram*2
5. Disassembly Rear cover sub assay
6. Disassembly Camera Module, PCB modules
7. Disassembly Thermal module Fan
8. Disassembly Mother board shielding
9. Disassembly WLAN Card
10. Disassembly Thermal module
11. Disassembly CPU
12. Disassembly Hinge Cap L&R
13. Disassembly Stand unit
14. Disassembly Support bridge
15. Disassembly Mother Board + USB 3.0 PCB and RTC battery
16. Disassembly Separate the USB 3.0 PCB from M/B
17. Disassembly Speaker left & right side
18. Disassembly Base Pan sub assay
19. Disassembly Loosen FPC
20. Disassembly LCD Panel
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
3.21 Disassembly Ram Door 3.22 Disassembly HDD & Dongle
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
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