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4. Remove the fan/heat sink assembly (4).

NOTE: Due to the adhesive quality of the thermal material located between the fan/heat sink

assembly and system board components, it may be necessary to move the fan/heat sink

assembly from side to side to detach it from the system board.

NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink

assembly and the system board each time the fan/heat sink assembly is removed: Thermal

paste is used on the processor (1) and the fan/heat sink assembly section (2) that services it.

Reverse this procedure to install the fan/heat sink assembly.

Component replacement procedures

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HP Mini 110 Specifications

General

Graphics	Intel GMA 950
Wireless	802.11b/g
RAM	1GB
Storage	160GB HDD
Display	10.1 inch
Resolution	1024 x 600
Weight	1.06 kg (2.34 lbs) with 3-cell battery
Ports	3 x USB 2.0, 1 x VGA, 1 x Headphone/Microphone combo