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HP Pavilion g4 User Manual

HP Pavilion g4
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Drive handling
CAUTION: Drives are fragile components that must be handled with care. To prevent damage to
the computer, damage to a drive, or loss of information, observe these precautions:
Before removing or inserting a hard drive, shut down the computer.
Before handling a drive, be sure that you are discharged of static electricity. While handling a drive,
avoid touching the connector.
Before removing a diskette drive or optical drive, be sure that a diskette or disc is not in the drive and
be sure that the optical drive tray is closed.
Handle drives on surfaces covered with at least one inch of shock-proof foam.
Avoid dropping drives from any height onto any surface.
After removing a hard drive, an optical drive, or a diskette drive, place it in a static-proof bag.
Avoid exposing an internal hard drive to products that have magnetic fields, such as monitors
or speakers.
Avoid exposing a drive to temperature extremes or liquids.
If a drive must be mailed, place the drive in a bubble pack mailer or other suitable form of protective
packaging and label the package “FRAGILE.”
Grounding guidelines
Electrostatic discharge damage
Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure
determine the degree of sensitivity. Networks built into many integrated circuits provide some
protection, but in many cases, ESD contains enough power to alter device parameters or melt
silicon junctions.
A discharge of static electricity from a finger or other conductor can destroy static-sensitive devices or
microcircuitry. Even if the spark is neither felt nor heard, damage may have occurred.
An electronic device exposed to ESD may not be affected at all and can work perfectly throughout a
normal cycle. Or the device may function normally for a while, then degrade in the internal layers,
reducing its life expectancy.
CAUTION: To prevent damage to the computer when you are removing or installing internal
components, observe these precautions:
Keep components in their electrostatic-safe containers until you are ready to install them.
Before touching an electronic component, discharge static electricity by using the guidelines described
in this section.
Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible.
If you remove a component, place it in an electrostatic-safe container.
The following table shows how humidity affects the electrostatic voltage levels generated by
different activities.
32 Chapter 4 Removal and replacement procedures ENWW

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HP Pavilion g4 Specifications

General IconGeneral
Bus typeDMI
SteppingJ1
Tjunction85 °C
Processor cache3 MB
Processor cores2
Processor modeli3-2350M
System bus rate5 GT/s
Processor familyIntel® Core™ i3
Processor seriesIntel Core i3-2300 Mobile Series
Processor socketSocket 988
Processor threads4
Processor codenameSandy Bridge
Processor frequency2.3 GHz
Processor cache typeL3
Processor lithography32 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version2.0
Processor operating modes64-bit
ECC supported by processorNo
PCI Express configurations1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)35 W
CPU multiplier (bus/core ratio)23
Maximum number of PCI Express lanes16
Motherboard chipset-
Internal memory4 GB
Internal memory typeDDR3-SDRAM
Maximum internal memory8 GB
Memory layout (slots x size)1 x 4 GB
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD Super Multi
Card reader integratedYes
Total storage capacity500 GB
Compatible memory cardsMMC, SD
Number of HDDs installed1
HD typeNot supported
Display surfaceGloss
Display diagonal14 \
Display resolution1366 x 768 pixels
Native aspect ratio16:9
On-board graphics card ID0x116
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 3000
On-board graphics card familyIntel® HD Graphics
On-board graphics card base frequency650 MHz
On-board graphics card dynamic frequency (max)1150 MHz
Audio systemDolby Advanced Audio v2
Speakers manufacturerAltec Lansing
Wi-Fi standards802.11b, 802.11g, Wi-Fi 4 (802.11n)
Ethernet LAN data rates10, 100 Mbit/s
Charging port typeDC-in jack
Headphone connectivity3.5 mm
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
eSATA/USB 2.0 ports quantity0
Pointing deviceTouchpad
Operating system installedWindows 7 Home Basic
Form factorClamshell
Product typeLaptop
Product colorBlack
Country of originChina
Processor codeSR0DN
Processor ARK ID53438
Processor package size37.5 x 37.5 (rPGA988B); 31 x 24 (BGA1023) mm
Supported instruction setsAVX
Intel Identity Protection Technology version1.00
Battery capacity47 Wh
Battery life (max)- h
Number of battery cells6
AC adapter power65 W
Weight and Dimensions IconWeight and Dimensions
Depth230.4 mm
Width347 mm
Weight2190 g
Height (rear)35.9 mm
Height (front)30 mm

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