HP Pavilion g4 User Manual

2.
Remove the PCH heat sink by lifting straight up (2).
NOTE: Due to the adhesive quality of the thermal material located between the heat sink and
system board components, it may be necessary to move the heat sink from side to side to
detach it.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board components each time the heat sink is removed. Replacement thermal material is
included with the base enclosure, heat sink, processor, and system board spare part kits.
Reverse this procedure to install the PCH heat sink.
Processor
NOTE: Only the processors listed below can be replaced on a system board. The processor spare
part kit includes replacement thermal material.
Description Spare part number
AMD A10-4600M processor (3.2 GHz/2.3 GHz, 1600 MHz/4.0 MB L2 cache, DDR3, quad core,
35W)
683046-001
AMD A8-4500M processor (2.8 GHz/1.9 GHz, 1600 MHz/4.0 MB L2 cache, DDR3, quad core,
35W)
683048-001
AMD A6-4400M processor (3.2 GHz/2.7 GHz, 1600 MHz/1.0 MB L2 cache, DDR3, dual core,
35W)
683047-001
AMD A4-4300M processor (3.0 GHz/2.5 GHz, 1600 MHz/1.0 MB L2 cache, DDR3, dual core,
35W)
685990-001
Before removing the processor, follow these steps:
1.
Shut down the computer.
2. Disconnect all external devices connected to the computer.
ENWW
Component replacement procedures
83

HP Pavilion g4 Specifications

General

Bus type	DMI
Stepping	J1
Tjunction	85 °C
Processor cache	3 MB
Processor cores	2
Processor model	i3-2350M
System bus rate	5 GT/s
Processor family	Intel® Core™ i3
Processor series	Intel Core i3-2300 Mobile Series
Processor socket	Socket 988
Processor threads	4
Processor codename	Sandy Bridge
Processor frequency	2.3 GHz
Processor cache type	L3
Processor lithography	32 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)	35 W
CPU multiplier (bus/core ratio)	23
Maximum number of PCI Express lanes	16
Motherboard chipset	-
Internal memory	4 GB
Internal memory type	DDR3-SDRAM
Maximum internal memory	8 GB
Memory layout (slots x size)	1 x 4 GB
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi
Card reader integrated	Yes
Total storage capacity	500 GB
Compatible memory cards	MMC, SD
Number of HDDs installed	1
HD type	Not supported
Display surface	Gloss
Display diagonal	14 \
Display resolution	1366 x 768 pixels
Native aspect ratio	16:9
On-board graphics card ID	0x116
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 3000
On-board graphics card family	Intel® HD Graphics
On-board graphics card base frequency	650 MHz
On-board graphics card dynamic frequency (max)	1150 MHz
Audio system	Dolby Advanced Audio v2
Speakers manufacturer	Altec Lansing
Wi-Fi standards	802.11b, 802.11g, Wi-Fi 4 (802.11n)
Ethernet LAN data rates	10, 100 Mbit/s
Charging port type	DC-in jack
Headphone connectivity	3.5 mm
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
eSATA/USB 2.0 ports quantity	0
Pointing device	Touchpad
Operating system installed	Windows 7 Home Basic
Form factor	Clamshell
Product type	Laptop
Product color	Black
Country of origin	China
Processor code	SR0DN
Processor ARK ID	53438
Processor package size	37.5 x 37.5 (rPGA988B); 31 x 24 (BGA1023) mm
Supported instruction sets	AVX
Intel Identity Protection Technology version	1.00
Battery capacity	47 Wh
Battery life (max)	- h
Number of battery cells	6
AC adapter power	65 W

Weight and Dimensions

Depth	230.4 mm
Width	347 mm
Weight	2190 g
Height (rear)	35.9 mm
Height (front)	30 mm