HP ProDesk 400 G5 User Manual

EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP ProDesk 400 G5 SFF Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
MB, VGA card, Legacy card, Memory*2, SSD, Type
C board
7
Batteries
All types including standard alkaline and lithium coin
or button style batteries RTC
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
Power cord
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
0

HP ProDesk 400 G5 Specifications

General

Processor	Intel Core i3/i5/i7/i9, Pentium, Celeron (varies by configuration)
RAM	Up to 64GB DDR4 (varies by configuration)
Operating System	Windows 10 Pro
Form Factor	Available in Small Form Factor (SFF) and Mini Tower (MT)
Dimensions	Varies by form factor
Power Supply	Varies by form factor and configuration
Networking	Gigabit Ethernet, optional Wi-Fi (varies by configuration)
Ports (Front)	USB 3.1 Gen 1
Ports (Rear)	DisplayPort, HDMI, Ethernet, audio (varies by configuration)
Storage	HDD, SSD, or NVMe (varies by configuration)
Graphics	Integrated Intel UHD Graphics or optional discrete GPU (varies by configuration)

Summary

Items Requiring Selective Treatment

Tools Required for Disassembly

Product Disassembly Steps

Remove Side Panel

Instructions for removing the side panel of the PC chassis.

Remove Front Bezel

Procedure to release and remove the front bezel from the PC.

Disconnect ODD and HDD Cables

Disconnecting optical drive and hard disk drive cables.

Remove Drive Cage

Steps to release and remove the drive cage assembly.

Remove Front I/O Bracket

Procedure to remove the Front I/O bracket from the chassis.

Remove Hard Disk Drive (HDD)

Instructions to release and remove the Hard Disk Drive (HDD).

Release All Internal Cables

Guidance on disconnecting all internal cables within the PC.

Remove Fan Duct

Steps to release and remove the cooling fan duct.

Remove CPU Cooler

Procedure to remove the CPU cooler assembly.

Remove Central Processing Unit (CPU)

Instructions for unlocking and removing the Central Processing Unit (CPU).

Remove Memory Modules

Steps to release and remove memory modules.

Remove Wireless LAN Card

Procedure to release and remove the Wireless LAN card.

Remove PCI Express Cards

Instructions to release and remove PCI Express cards.

Remove Card Reader

Steps to release and remove the card reader component.

Remove Antenna Cable

Procedure to release and remove the antenna cable.

Remove Motherboard (MB)

Instructions to release and remove the Motherboard (MB).

Remove Power Supply Unit (PSU)

Steps to release and remove the Power Supply Unit (PSU).

Remove Speaker

Procedure to release and remove the speaker component.