HP ProLiant DL560 - Page 4

For hyper-dense servers, form factor dictates the memory footprint and I/O slot count. The GC-LE
chipset offers an integrated memory controller that reduces board space and cost while offering
excellent performance for memory capacities up to 12 gigabytes (GB). In the ProLiant DL560 server,
use of direct-attach memory (Figure 3) eliminates the need for and cost of memory buffers like those
used in the ProLiant DL580 Generation 2 server (Figure 4).
Figure 2. ServerWorks Grand Champion LE chipset architecture
CMIC-
L
E
IMBus
DDR 200
DDR 200
CIOB-X
CIOB-X
BMC5701
BMC5701
CSB5
Legacy I/O
GC LE
8B
8B
32-bit PCI
PCI-X
Pentium 4 Xeon Processors
Figure 3. Block diagram of the ProLiant DL560 system architecture
PC2100
USB (2)
CMIC-LE
ROM
IDE
PC87413
Super I/O
Thin
IMB
Rage XL
CSB5
200MHz
PCI
PC2100
PC2100
Xeon with
2MB L3
cache
FSB
iLO
IMB 2 IMB 1
CIOB-X2
CIOB-X2
PCI-XPCI-X
PCI-XPCI-X
NC7781
NC7781
PC2100
PC2100
PC2100
Dual interleaved
100MHz
133MHz
Smart
Array
5i Plus
100MHz 100MHz
Xeon with
2MB L3
cache
Xeon with
2MB L3
cache
Xeon with
2MB L3
cache
Keyboard
Mouse
Serial
Diskette
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