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HP ProLiant DL560 - Customer Self Repair

HP ProLiant DL560
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Figure 4. Block diagram of the ProLiant DL580 G2 system architecture
RagePro XL
iLO
Frontside Bus
CMIC
Xeon Xeon Xeon Xeon
CIOB-X
CSB5
Embedded Smart Array
5i Plus Controller
SuperI/O
NC7770NC7770
IMB
IMB
CIOB-X
Thin IMB
PCI Compatibility Bus
Quick Switches
Keyboard
Mouse
Serial
Diskette
LPC
ROM
X-Bus
REMC
REMC
REMC
REMC
REMC
REMC
REMC
REMC
REMC
REMC
IDE
USB
REMC
REMC
REMC
REMC
REMC
REMC
REMC
REMC
REMC
REMC
The ProLiant DL560 server has a tool-free and virtually cable-free internal design. Essential features of
the server architecture include:
Up to four Intel Xeon MP processors
400-MHz front side bus
Intel Hyper-Thread technology for optimized performance
DDR SDRAM memory with Advanced Memory Protection technology
PCI-X architecture
Wide Ulltra320 SCSI technology
Gigabit networking technology
Embedded technologies
Hot-plug technology
Flexibility of high line or low line AC power
Support for today’s leading industry-standard operating systems
Intel Xeon MP processor
Processor subsystem
Models of the ProLiant DL560 server ship standard with one or two Intel
Xeon processors MP (right). For first generation DL560 servers,
customers may choose from available processor speeds of 1.50, 1.90,
2.00, 2.5, or 2.8 gigahertz (GHz). The 400-MHz system bus, which is
quad-pumped and runs off a 100-MHz system bus clock, provides data
transfer rates of up to 3.2 gigabytes per second (GB/s).
The Intel Xeon Processor MP is manufactured using a 130-nanometer
(0.13-micron) process to allow higher frequencies and better
performance. The term 0.13 micron refers to the circuit (feature) size.
By reducing the feature size, processor manufacturers can pack more
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