IBM 6552-23N - Table of Contents

6552-23N/23S/63N/63S
– 5 –
Note: Hand degauss must be used on stand-by or power-off condition.
This model has an automatic earth magnetism correction function by using an earth
magnetism sensor and a LCC coil. When using a hand degauss while monitor (LCC
coil) is being operated, it sometimes gets magnetized, and the system may not work
properly as a result.
TABLE OF CONTENTS
Section Title Page
1. GENERAL ................................................................. 1-1
2. DISASSEMBLY
2-1. Cabinet Removal ............................................... 2-1
2-2. D Board Removal .............................................. 2-1
2-3. G Board Removal .............................................. 2-2
2-4. A Board, I/O Terminal Board Assembly
Removal ............................................................. 2-2
2-5. N Board Removal .............................................. 2-3
2-6. Service Position .................................................. 2-3
2-7. Bezel Assembly, H Board Removal .................. 2-4
2-8. J Board Removal ............................................... 2-4
2-9. Picture Tube Removal ....................................... 2-5
2-10. Harness Location ............................................... 2-6
3. SAFETY RELATED ADJUSTMENT............. 3-1
4. ADJUSTMENTS ..................................................... 4-1
5. DIAGRAMS
5-1. Block Diagrams .................................................. 5-1
5-2. Frame Schematic Diagram ................................. 5-7
5-3. Circuit Boards Location ..................................... 5-9
5-4. Schematic Diagrams and Printed Wiring
Boards ................................................................. 5-9
(1) Schematic Diagram of A Board ........................ 5-11
(2) Schematic Diagrams of H, J Boards ................. 5-17
(3) Schematic Diagram of D Board ........................ 5-19
(4) Schematic Diagrams of N (a, b, c) Board 5-23
(5) Schematic Diagram of G Board ........................ 5-31
5-5. Semiconductors ................................................. 5-35
6. EXPLODED VIEWS
6-1. Chassis ............................................................... 6-1
6-2. Picture Tube ...................................................... 6-2
6-3. Packing Materials ............................................... 6-3
7. ELECTRICAL PARTS LIST ............................ 7-1