IBM BladeCenter HS22 User Manual

To install a DIMM, complete the following steps:
1. Before you begin, read “Safety” on page v and “Installation guidelines” on
page 21.
2. Read the documentation that comes with the DIMMs.
3. If the blade server is installed in a BladeCenter unit, remove it (see
“Removing the blade server from the BladeCenter unit” on page 23 for
instructions).
4. Carefully lay the blade server on a flat, static-protective surface.
5. Open the blade server cover (see “Removing the blade server cover” on page
24 for instructions).
6. If an expansion unit is installed and you are installing DIMMs on the system
board, remove the expansion unit (see “Removing an optional expansion unit”
on page 26).
7. Locate the DIMM connectors (see “Blade server connectors” on page 19).
Determine which DIMM connector you will be installing memory into.
8. If a DIMM filler or another memory module is already installed in the DIMM
connector, remove it (see “Removing a memory module” on page 33).
Note: A DIMM or DIMM filler must occupy each DIMM socket before the
blade server is turned on.
9. If you are installing a DIMM in DIMM connector seven through twelve, use
your fingers to lift the DIMM access door.
10. Touch the static-protective package that contains the DIMM to any unpainted
metal surface on the BladeCenter unit or any unpainted metal surface on any
other grounded rack component in the rack in which you are installing the
DIMM for at least two seconds; then, remove the DIMM from its package.
11. To install the DIMMs, repeat the following steps for each DIMM that you
install:
Retaining
clip
DIMM
32 BladeCenter HS22 Type 7870 and 1936: Installation and User's Guide

IBM BladeCenter HS22 Specifications

General

Tcase	76.2 °C
Bus type	QPI
Stepping	B1
FSB Parity	No
Processor code	SLBZ8
Processor cache	12 MB
Processor cores	6
Processor model	E5649
System bus rate	5.86 GT/s
Processor series	Intel Xeon 5600 Series
Processor socket	Socket B (LGA 1366)
Processor threads	12
Processor codename	Westmere EP
Processor frequency	2.53 GHz
Processor cache type	Smart Cache
Processor lithography	32 nm
Processor manufacturer	Intel
Processor package size	42.5 X 45 mm
Processor front side bus	1333 MHz
Processor boost frequency	2.93 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
Supported instruction sets	SSE4.2
Thermal Design Power (TDP)	80 W
Compatible processor series	Intel® Xeon®
Number of processors installed	1
CPU multiplier (bus/core ratio)	19
Maximum number of SMP processors	2
Physical Address Extension (PAE)	40 bit
Memory types supported by processor	DDR3 800/1066/1333
Memory channels supported by processor	Triple
Memory bandwidth supported by processor (max)	32 GB/s
Maximum internal memory supported by processor	288 GB
HDD size	2.5 \
RAID levels	0, 1
HDD interface	Serial Attached SCSI (SAS)
Total storage capacity	0 GB
Maximum storage capacity	1 TB
Number of HDDs installed	0
Internal memory	12 GB
Memory clock speed	- MHz
Internal memory type	DDR3-SDRAM
Maximum internal memory	192 GB
Memory layout (slots x size)	3 x 4 GB
Graphics card	G200eV
Graphics card memory type	GDDR2
Networking features	Gigabit Ethernet
PS/2 ports quantity	-
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Compatible operating systems	Microsoft Windows RedHat, SUSE, VMware Oracle Solaris
Chassis type	Rack (1U)
Processor ARK ID	52581
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Depth	446 mm
Width	245 mm
Height	29 mm
Weight	5400 g