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IBM BladeCenter HS22 User Manual

IBM BladeCenter HS22
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b. Rotate the locking lever on the microprocessor socket from its closed and
locked position until it stops in the fully open position (approximately a
135° angle), as shown.
c. Rotate the microprocessor retainer on the microprocessor socket from its
closed position until it stops in the fully open position (approximately a
135° angle), as shown.
d. If a dust cover is installed over the microprocessor socket, lift the dust
cover from the socket.
e. Touch the static-protective package that contains the microprocessor to any
unpainted metal surface on the BladeCenter unit or any unpainted metal
surface on any other grounded rack component; then, remove the
microprocessor from the package.
f. Remove the dust cover from the bottom of the microprocessor.
Microprocessor
Microprocessor
socket
Alignment marks
Microprocessor retainer
g. Orient the triangle painted on the corner of the microprocessor with the
triangle on the microprocessor socket.
h. Carefully place the microprocessor into the microprocessor socket, using
the alignment tabs on the microprocessor with the alignment notches in
the microprocessor socket as a guide.
Attention:
v Do not press the microprocessor into the socket.
v Make sure that the microprocessor is oriented and aligned correctly in
the socket before you try to close the microprocessor retainer.
i. Carefully close the microprocessor retainer.
j. Rotate the locking lever on the microprocessor socket to the closed and
locked position. Make sure that the lever is secured in the locked position
by pressing the tab on the microprocessor socket.
9. Install a heat sink on the microprocessor.
Attention:
v Do not set down the heat sink after you remove the plastic cover.
v Do not touch the thermal material on the bottom of the heat sink. Touching
the thermal material will contaminate it. If the thermal material on the
microprocessor or heat sink becomes contaminated, contact your service
technician.
a. Remove the plastic protective cover from the bottom of the heat sink.
b. Make sure that the thermal material is still on the bottom of the heat sink;
then, align and place the heat sink on top of the microprocessor in the
retention bracket, thermal material side down. Press firmly on the heat
sink.
36 BladeCenter HS22 Type 7870 and 1936: Installation and User's Guide

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IBM BladeCenter HS22 Specifications

General IconGeneral
Tcase76.2 °C
Bus typeQPI
SteppingB1
FSB ParityNo
Processor codeSLBZ8
Processor cache12 MB
Processor cores6
Processor modelE5649
System bus rate5.86 GT/s
Processor seriesIntel Xeon 5600 Series
Processor socketSocket B (LGA 1366)
Processor threads12
Processor codenameWestmere EP
Processor frequency2.53 GHz
Processor cache typeSmart Cache
Processor lithography32 nm
Processor manufacturerIntel
Processor package size42.5 X 45 mm
Processor front side bus1333 MHz
Processor boost frequency2.93 GHz
Processor operating modes64-bit
ECC supported by processorYes
Supported instruction setsSSE4.2
Thermal Design Power (TDP)80 W
Compatible processor seriesIntel® Xeon®
Number of processors installed1
CPU multiplier (bus/core ratio)19
Maximum number of SMP processors2
Physical Address Extension (PAE)40 bit
Memory types supported by processorDDR3 800/1066/1333
Memory channels supported by processorTriple
Memory bandwidth supported by processor (max)32 GB/s
Maximum internal memory supported by processor288 GB
HDD size2.5 \
RAID levels0, 1
HDD interfaceSerial Attached SCSI (SAS)
Total storage capacity0 GB
Maximum storage capacity1 TB
Number of HDDs installed0
Internal memory12 GB
Memory clock speed- MHz
Internal memory typeDDR3-SDRAM
Maximum internal memory192 GB
Memory layout (slots x size)3 x 4 GB
Graphics cardG200eV
Graphics card memory typeGDDR2
Networking featuresGigabit Ethernet
PS/2 ports quantity-
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Compatible operating systemsMicrosoft Windows RedHat, SUSE, VMware Oracle Solaris
Chassis typeRack (1U)
Processor ARK ID52581
Intel® Turbo Boost Technology1.0
Weight and Dimensions IconWeight and Dimensions
Depth446 mm
Width245 mm
Height29 mm
Weight5400 g

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