IBM System x3550 M3 User Manual

IBM System x3550 M3 15
Table 5. Memory options (Part 2)
Part
number
Feature
code
Description Maximum
supported*
Models where
used
1333 MHz RDIMMs
44T1592 1712 2GB (1x2GB, 1Rx8, 1.5V) PC3-10600 CL9 ECC
DDR3 1333MHz LP RDIMM
18 -
49Y1434 8935 2GB (1x2GB, 1Rx4, 1.5V) PC3-10600 CL9 ECC
DDR3 1333MHz LP RDIMM
18 -
49Y1405 8940 2GB (1x2GB, 1Rx8, 1.35V) PC3L-10600 CL9 ECC
DDR3 1333MHz LP RDIMM
18 E4x, E5x
49Y1433 8934 2GB (1x2GB, 2Rx8, 1.5V) PC3-10600 CL9 ECC
DDR3 1333MHz LP RDIMM
18 -
49Y1392 3893 2GB (1x2GB, 2Rx8, 1.35V) PC3L-10600 CL9 ECC
DDR3 1333MHz LP RDIMM
18 -
49Y1406 8941 4GB (1x4GB, 1Rx4, 1.35V) PC3L-10600 CL9 ECC
DDR3 1333MHz LP RDIMM
18 12x, 22x, 32x,
D4x, H4x, 52x,
54x, 62x, J4x,
72x, 82x, E6x
49Y1435 8936 4GB (1x4GB, 2Rx4, 1.5V) PC3-10600 CL9 ECC
DDR3 1333MHz LP RDIMM
18 -
49Y1394 3894 4GB (1x4GB, 2Rx4, 1.35V) PC3L-10600 CL9 ECC
DDR3 1333MHz LP RDIMM
18 C2x, H2x
44T1599 1713 4GB (1x4GB, Dual Rankx8) PC3-10600 CL9 ECC
DDR3 1333MHz LP RDIMM
18 -
49Y1407 8942 4GB (1x4GB, 2Rx8, 1.35V) PC3L-10600 CL9ECC
DDR3 1333MHz LP RDIMM
18 -
49Y1436 8937 8GB (1x8GB, 2Rx4, 1.5V) PC3-10600 CL9 ECC
DDR3 1333MHz LP RDIMM
18 -
49Y1397 8923 8GB (1x8GB, 2Rx4, 1.35V) PC3L-10600 CL9 ECC
DDR3 1333MHz LP RDIMM
18 -
49Y1563 A1QT 16GB (1x16GB, 2Rx4, 1.35V) PC3L-10600 CL9 ECC
DDR3 1333MHz LP RDIMM
18 -
1066 MHz RDIMMs
49Y1398 8921 8GB (1x8GB, 2Rx4, 1.35V) PC3L-8500 CL7 ECC
DDR3 1066MHz LP RDIMM
18 -
49Y1400 8939 16GB (1x16GB, 4Rx4, 1.35V) PC3L-8500 CL7 ECC
DDR3 1066MHz LP RDIMM
12 -
46C7483 1707 16GB (1x16GB, 4Rx4, 1.5V) PC3-8500 CL7 ECC
DDR3 1066MHz LP RDIMM
12 -
* Maximum supported with two processors installed. With one processor installed, halve the number.

IBM System x3550 M3 Specifications

General

Tcase	77.6 °C
Bus type	QPI
Stepping	B1
FSB Parity	No
Processor code	SLBV4
Processor cache	12 MB
Processor cores	4
Processor model	E5620
System bus rate	5.86 GT/s
Processor series	Intel Xeon 5600 Series
Processor socket	Socket B (LGA 1366)
Processor threads	8
Processor codename	Westmere EP
Processor frequency	2.4 GHz
Processor cache type	Smart Cache
Processor lithography	32 nm
Processor manufacturer	Intel
Processor package size	42.5 X 45 mm
Processor front side bus	- MHz
Processor boost frequency	2.66 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
Supported instruction sets	SSE4.2
Thermal Design Power (TDP)	80 W
Number of processors installed	2
CPU multiplier (bus/core ratio)	18
Physical Address Extension (PAE)	40 bit
Memory types supported by processor	DDR3 800/1066
Memory channels supported by processor	Triple
Memory clock speeds supported by processor	800, 1066 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	288 GB
HDD size	2.5 \
RAID levels	0, 1, 10
HDD interface	Serial Attached SCSI (SAS)
Optical drive type	-
Total storage capacity	0 GB
Maximum storage capacity	8 TB
Number of HDDs installed	0
Internal memory	24 GB
Internal memory type	DDR3-SDRAM
Maximum internal memory	192 GB
Memory layout (slots x size)	6 x 4 GB
Maximum graphics card memory	16 MB
Graphics card family	Matrox
Graphics card memory type	GDDR2
Cabling technology	10/100/1000Base-T(X)
Ethernet interface type	Gigabit Ethernet
Serial ports quantity	1
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Ethernet LAN (RJ-45) ports	3
Power supply	460 W
Power supply type	AC
Power requirements	100 - 240 V
Power supply input frequency	50 - 60 Hz
Compatible operating systems	Microsoft Windows Server 2008 R2 and 2008, Red Hat Enterprise Linux, SUSE Linux Enterprise Server and VMware ESXi, Oracle Solaris 10 (model dependent)
Storage temperature (T-T)	-40 - 60 °C
Operating temperature (T-T)	10 - 35 °C
Storage relative humidity (H-H)	8 - 80 %
Chassis type	Rack (1U)
Processor ARK ID	47925
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Depth	711 mm
Width	440 mm
Height	43 mm
Weight	15600 g