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IBM System x3550 M3 User Manual

IBM System x3550 M3
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IBM System x3550 M3 30
Regulatory compliance
The server conforms to the following international standards:
FCC - Verified to comply with Part 15 of the FCC Rules, Class A
Canada ICES-003, issue 4, Class A
UL/IEC 60950-1
CSA C22.2 No. 69950-1-03
NOM-019
Argentina IEC60950-1
Japan VCCI, Class A
Australia/New Zealand AS/NZS CISPR 22:2006, Class A
IEC-60950-1:2001 (CB Certificate and CB Test Report)
Taiwan BSMI CNS 13438, Class A; CNS 14336
China CCC (4943-2001), GB 9254-2008 Class A, GB 17625.1:2003
Korea KN22, Class A; KN24
Russia/GOST ME01, IEC-60950-1, GOST R 51318.22-99, GOST R 51318.24-99, GOST R
51317.3.2-2006, GOST R 51317.3.3-99
IEC 60950-1 (CB Certificate and CB Test Report)
CE Mark (EN55022 Class A, EN60950-1, EN55024, EN61000-3-2, EN61000-3-3)
CISPR 22, Class A
TUV-GS (EN60950-1 /IEC60950-1,EK1-ITB2000)
External disk storage expansion
The external disk storage expansion enclosures listed in the following table are available.
Table 18. External storage expansion enclosures
Part number Description Maximum quantity supported
per one M5025
172701X IBM System Storage® EXP3000 18 (9 per port)
174712X IBM System Storage EXP2512 Express 18 (9 per port)
174724X IBM System Storage EXP2524 Express 9 (9 per port)

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IBM System x3550 M3 Specifications

General IconGeneral
Tcase77.6 °C
Bus typeQPI
SteppingB1
FSB ParityNo
Processor codeSLBV4
Processor cache12 MB
Processor cores4
Processor modelE5620
System bus rate5.86 GT/s
Processor seriesIntel Xeon 5600 Series
Processor socketSocket B (LGA 1366)
Processor threads8
Processor codenameWestmere EP
Processor frequency2.4 GHz
Processor cache typeSmart Cache
Processor lithography32 nm
Processor manufacturerIntel
Processor package size42.5 X 45 mm
Processor front side bus- MHz
Processor boost frequency2.66 GHz
Processor operating modes64-bit
ECC supported by processorYes
Supported instruction setsSSE4.2
Thermal Design Power (TDP)80 W
Number of processors installed2
CPU multiplier (bus/core ratio)18
Physical Address Extension (PAE)40 bit
Memory types supported by processorDDR3 800/1066
Memory channels supported by processorTriple
Memory clock speeds supported by processor800, 1066 MHz
Memory bandwidth supported by processor (max)25.6 GB/s
Maximum internal memory supported by processor288 GB
HDD size2.5 \
RAID levels0, 1, 10
HDD interfaceSerial Attached SCSI (SAS)
Optical drive type-
Total storage capacity0 GB
Maximum storage capacity8 TB
Number of HDDs installed0
Internal memory24 GB
Internal memory typeDDR3-SDRAM
Maximum internal memory192 GB
Memory layout (slots x size)6 x 4 GB
Maximum graphics card memory16 MB
Graphics card familyMatrox
Graphics card memory typeGDDR2
Cabling technology10/100/1000Base-T(X)
Ethernet interface typeGigabit Ethernet
Serial ports quantity1
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Ethernet LAN (RJ-45) ports3
Power supply460 W
Power supply typeAC
Power requirements100 - 240 V
Power supply input frequency50 - 60 Hz
Compatible operating systemsMicrosoft Windows Server 2008 R2 and 2008, Red Hat Enterprise Linux, SUSE Linux Enterprise Server and VMware ESXi, Oracle Solaris 10 (model dependent)
Storage temperature (T-T)-40 - 60 °C
Operating temperature (T-T)10 - 35 °C
Storage relative humidity (H-H)8 - 80 %
Chassis typeRack (1U)
Processor ARK ID47925
Intel® Turbo Boost Technology1.0
Weight and Dimensions IconWeight and Dimensions
Depth711 mm
Width440 mm
Height43 mm
Weight15600 g

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