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IBM System x3550 M3 User Manual

IBM System x3550 M3
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IBM System x3550 M3 3
An optional Virtual Media Key enables additional systems management capabilities, including
web-based out-of-band remote control (keyboard video and mouse), remote optical drive support,
Windows “blue screen” error capture, and support for LDAP and SSL protocols.
Text Console Redirection support allows the administrator to remotely view x3550 M3 text messages
over Serial or LAN connections.
Integrated industry-standard Unified Extensible Firmware Interface (UEFI) next-generation BIOS.
New capabilities include:
Human readable event logs — no more beep codes.
Complete out-of-band coverage by the Advance Settings Utility to simplify remote setup.
A complete setup solution, allowing adapter configuration functions to be moved into UEFI.
Integrated Trusted Platform Module (TPM) 1.2 support.
Industry-standard AES NI support for faster, stronger encryption.
Integrated IPMI 2.0 support alerts IBM Systems Director to anomalous environmental factors, such as
voltage and thermal conditions. It also supports highly secure remote power control using data
encryption.
IBM Systems Director is included for proactive systems management. IBM Systems Director comes
with a portfolio of tools, including IBM Systems Director Active Energy Manager, IBM Service and
Support Manager, and others. IBM Systems Director also offers extended systems management tools
for additional server management and increased availability. When a problem is encountered, IBM
Systems Director can issue administrator alerts via email, pager, and other methods.
IBM Systems Director Active Energy Manager provides advanced power management features with
actual real-time energy monitoring, reporting, and capping features.
Availability and serviceability
The System x3550 M3 provides many features to simplify serviceability and increase system uptime:
The x3550 M3 servers offer Chipkill ECC memory protection (when using x4 DIMMs). Chipkill
memory is up to 16 times better than standard ECC memory at correcting memory errors. This can
help reduce downtime caused by memory errors.
The x3550 M3 offers memory mirroring for redundancy in the event of a non-correctable memory
failure.
Toolless cover removal provides easy access to upgrades and serviceable parts, such as HDDs and
memory. Similarly, the Virtual Media Key and the ServeRAID controller can be installed and replaced
without tools. This means less time (and therefore less money) spent servicing the x3550 M3.
The server offers hot-swap and redundant fan modules and power supplies and hot-swap disk drives
(redundant when implemented in conjunction with a RAID controller). These features mean greater
system uptime.
Toolless slides ship with the server, together with a cable management arm (CMA), that allows the
rack server to easily slide into place.
The drop-down light path diagnostics panel and individual light path LEDs quickly lead the technician
to failed (or failing) components. This simplifies servicing, speeds up problem resolution, and helps
improve system availability.
Solid-state drives (SSDs) offer significantly better reliability than traditional mechanical HDDs for
greater uptime.
The three-year (parts and labor) limited onsite warranty provides peace of mind and greater
investment protection than a one-year warranty does.

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IBM System x3550 M3 Specifications

General IconGeneral
Tcase77.6 °C
Bus typeQPI
SteppingB1
FSB ParityNo
Processor codeSLBV4
Processor cache12 MB
Processor cores4
Processor modelE5620
System bus rate5.86 GT/s
Processor seriesIntel Xeon 5600 Series
Processor socketSocket B (LGA 1366)
Processor threads8
Processor codenameWestmere EP
Processor frequency2.4 GHz
Processor cache typeSmart Cache
Processor lithography32 nm
Processor manufacturerIntel
Processor package size42.5 X 45 mm
Processor front side bus- MHz
Processor boost frequency2.66 GHz
Processor operating modes64-bit
ECC supported by processorYes
Supported instruction setsSSE4.2
Thermal Design Power (TDP)80 W
Number of processors installed2
CPU multiplier (bus/core ratio)18
Physical Address Extension (PAE)40 bit
Memory types supported by processorDDR3 800/1066
Memory channels supported by processorTriple
Memory clock speeds supported by processor800, 1066 MHz
Memory bandwidth supported by processor (max)25.6 GB/s
Maximum internal memory supported by processor288 GB
HDD size2.5 \
RAID levels0, 1, 10
HDD interfaceSerial Attached SCSI (SAS)
Optical drive type-
Total storage capacity0 GB
Maximum storage capacity8 TB
Number of HDDs installed0
Internal memory24 GB
Internal memory typeDDR3-SDRAM
Maximum internal memory192 GB
Memory layout (slots x size)6 x 4 GB
Maximum graphics card memory16 MB
Graphics card familyMatrox
Graphics card memory typeGDDR2
Cabling technology10/100/1000Base-T(X)
Ethernet interface typeGigabit Ethernet
Serial ports quantity1
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Ethernet LAN (RJ-45) ports3
Power supply460 W
Power supply typeAC
Power requirements100 - 240 V
Power supply input frequency50 - 60 Hz
Compatible operating systemsMicrosoft Windows Server 2008 R2 and 2008, Red Hat Enterprise Linux, SUSE Linux Enterprise Server and VMware ESXi, Oracle Solaris 10 (model dependent)
Storage temperature (T-T)-40 - 60 °C
Operating temperature (T-T)10 - 35 °C
Storage relative humidity (H-H)8 - 80 %
Chassis typeRack (1U)
Processor ARK ID47925
Intel® Turbo Boost Technology1.0
Weight and Dimensions IconWeight and Dimensions
Depth711 mm
Width440 mm
Height43 mm
Weight15600 g

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