Intel 80960KB

80960KB
30
Figure 22. HOLD Timing
Table 15. 80960KB PQFP Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
Airflow — ft./min (m/sec)
0
(0)
50
(0.25)
100
(0.50)
200
(1.01)
400
(2.03)
600
(3.04)
800
(4.06)
θ Junction-to-Case
9999999
θ Case-to-Ambient (No Heatsink)
22 19 18 16 11 9 8
NOTES:
1. This table applies to 80960KB PQFP soldered directly to board.
2. θ
JA
= θ
JC
+ θ
CA
3. θ
JL
= 18°C/W (approx.)
θ
JB
= 18°C/W (approx.)
θ
JC
θ
JL
θ
JB
T
h
T
h
T
h
CLK2
CLK
HOLD
HLDA
T
12
T
11
T
6H
T
9H