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80960KB
3.0 MECHANICAL DATA
3.1 Packaging
The 80960KB is available in two package types:
• 132-lead ceramic pin-grid array (PGA). Pins are
arranged 0.100 inch (2.54 mm) center-to-center, in
a 14 by 14 matrix, three rows around (see Figure
17).
• 132-lead plastic quad flat pack (PQFP). This
package uses fine-pitch gull wing leads arranged
in a single row along the package perimeter with
0.025 inch (0.64 mm) spacing (see Figure 20).
Dimensions for both package types are given in the
Intel
Packaging
handbook (Order #240800).
3.1.1 Pin Assignment
The PGA and PQFP have different pin assignments.
Figure 18 shows the view from the PGA bottom (pins
facing up) and Figure 19 shows a view from the PGA
top (pins facing down). Figure 20 shows the PQFP
package; Figure 21 shows the PQFP pinout with
signal names. Notice that the pins are numbered in
order from 1 to 132 around the package perimeter.
Table 10 and Table 11 list the function of each PGA
pin; Table 12 and Table 13 list the function of each
PQFP pin.
Figure 17. 132-Lead Pin-Grid Array (PGA) Package
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