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Intel BOXDQ67EPB3 - Thermal Considerations for Components

Intel BOXDQ67EPB3
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Technical Reference
61
Figure 16 shows the locations of the localized high temperature zones.
Item Description
A Processor voltage regulator area
B Processor
C Intel Q67 Express Chipset
Figure 16. Localized High Temperature Zones
Table 29 provides maximum case temperatures for the components that are sensitive
to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 29. Thermal Considerations for Components
Component Maximum Case Temperature
Processor For processor case temperature, see processor datasheets and
processor specification updates
Intel Q67 Express Chipset 111
o
C (under bias)
For information about Refer to
Processor datasheets and specification updates Section 1.3, page 14

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