Intel BOXDQ67EPB3 - Tables; Product Description; Overview; Feature Summary

9
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
Mini-ITX (6.7 inches by 6.7 inches [170.18 millimeters by 170.18 millimeters])
Processor
• Intel
®
Core™ i7, Intel
®
Core™ i5, Intel
®
Core™ i3, and Intel
®
Pentium
®
processors in an LGA1155 socket with up to 95 W TDP:
― Integrated graphics processing (processors with Intel
®
Graphics
Technology)
― External graphics interface controller
― Integrated memory controller
Note: Use of a 95 W TDP processor requires a custom thermal solution. See the Note on
page 14 for more information.
Chipset
Intel
®
Q67 Express Chipset consisting of the Intel
®
Q67 Platform Controller
Hub (PCH)
Memory
• Two 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 16 GB of system memory with two DIMMs using 4 Gb
memory technology
• Support for non-ECC memory
Graphics
• Integrated graphics support for processors with Intel
®
Graphics Technology:
― DVI-I
― DVI-D
― DisplayPort*
• Discrete graphics support for PCI Express 2.0 x16 add-in graphics card
Audio
• Intel
®
High Definition Audio:
― Realtek* ALC888S audio codec
― S/PDIF audio header
― DisplayPort Digital Audio
― Front panel audio header
― Mono speaker header
continued