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Technical Reference

2.6.1.2 Thermal Specifications Guideline

Terms Requirements

≤ 50 °C

≤ 100 °C

≤ 3.85 °C/W

TIM Honeywell PCM45F

TDP 10 W

external ≤ 35 °C

2.6.1.3 Heatsink Design Guideline

Maximum heatsink size

(Note)

87 x 52 x 29 mm

Heatsink mass ≤ 63.6 grams

Retention type Spring loaded fasteners

Heatsink preload 13.2 lb

Note: Refers to the heatsink installed on the board.

2.6.1.4 Chassis Design Guideline

The pin fin heatsink design used on this board will be able to dissipate up to 10 W of

processor power in most of the passively enabled system chassis. This board is

targeted for 3-7 liters volumetric or larger, desktop/tower orientation, mini-ITX and

microATX chassis with a system fan. The recommended fan type is an exhaust fan.

For best thermal performance, it is recommended that the system fan provide

reasonable airflow directly over all the major components on the board. The pin fin

heatsink is designed to have the best thermal performance when airflow direction is

parallel to the heatsink fins.

The processor on the board will generate the highest amount of heat, leading to high

ambient temperature within the chassis. The system fan should be located near the

board region in order to effectively regulate airflow (see Figure 18). A system fan

located further away from the board region, i.e., at the optical disk drive or hard disk

drive region, will be less effective in controlling the local ambient temperature.

Regardless of where the system fan is located, the maximum local ambient

temperature as defined by T

A should be capped at 50 °C. Chassis inlet vents should

also provide adequate openings for airflow to pass through. The recommended free-

area-ratio of chassis vents should be equal to or greater than 0.53. By using the

reference pin fin heatsink, most chassis with a system fan enabled should have local

ambient temperature safely below the 50 °C limit.

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